LTCC today and the technology development trends

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Abstract

The article examines the current state of LTCC technology as an industrially mature platform for the production of multilayer ceramic modules. It also analyzes the factors determining the technology’s relevance in the next decade and the main areas of its development.

About the authors

S. Khokhlun

ООО «АК Микротех»

Author for correspondence.
Email: kys@electronics.ru

инженер-технолог

Russian Federation

A. Sidorov

ООО «АК Микротех»

Email: kys@electronics.ru

начальник отдела сервиса

Russian Federation

References

  1. Liu C., Xu M., Kang X., Guo J., Zhang B., Wang H., Xu X., Jin H., Wang H. Advances in Low-Temperature Co-Fired Ceramics for Next-Generation Electronics Applications // https://pubmed.ncbi.nlm.nih.gov/41482688/.
  2. DuPont. DuPont GreenTape 951 Low Temperature Cofire Ceramic (LTCC) System: Technical Data Sheet // https://www.etsmtl.ca/uploads/Dupont_951.pdf.
  3. Kyocera. LTCC Technology for mmWave: Data sheet // https://germany.kyocera.com/uploads/eu/Data_sheet_SC_LTCC_Technology_for_mmWave_210723.pdf.
  4. Ferro. A6M / A6M-E: LTCC System. Technical Data Sheet // https://www.etsmtl.ca/uploads/Ferro_A6M.pdf.
  5. Sešek A., Makarovič K. Metallization, Material Selection, and Bonding of Interconnections for Novel LTCC and HTCC Power Modules // Materials. 2022. Vol. 15. No. 3. Art. 1036.
  6. Graddy P., Beikmohamadi A., Nair D., Thrasher B. Reliability of LTCC Using Electroless Nickel Immersion Gold (ENIG) Plating Technology // https://imapsource.org/api/v1/articles/57104-reliability-of-ltcc-using-electroless-nickel-immersion-gold-enig-plating-technology.pdf.
  7. Wang S., Hou T., Huo R., Chen Z., Zeng Q., He Y., Zhao Y., Liu X. Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits // Materials. 2023. Vol. 16, No. 20. Art. 6720.
  8. Lin J.-Jr., Lin C.-I., Kao T.-H., Huang M.-C. Low-Temperature Metallization and Laser Trimming Process for Microwave Dielectric Ceramic Filters // Materials. 2021.
  9. Yao Y., Chen C., Fu S., Jia Q., Wang W., Zeng H. Anti-oxidation copper powder with constructed calcium silicate hydrate nano-barrier layer for printable electrode paste // Surfaces and Interfaces. 2025. Vol. 65. Art. 106496.
  10. Shahbazi S., Grabey S., Persons R. A Low Firing Temperature Copper Conductor for Use on an Aluminum Metal Compatible Dielectric in LED Thermal Substrate Applications // https://imapsource.org/article/57183-a-low-firing-temperature-copper-conductor-for-use-on-an-aluminum-metal-compatible-dielectric-in-led-thermal-substrate-applications.pdf.
  11. Heraeus. C7401 Thick Film Copper Conductor: Technical Data Sheet // https://pim.heraeus.com/datasheets/HET/TFM/C7401.pdf.
  12. Shuwen L., Mingsheng M., Feng L., Zhifu L. Corrosion Behavior and Mechanism of LTCC Materials in Ca-B-Si System // Journal of Inorganic Materials. 2023. Vol. 38(5). PP. 553–560.

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