Elektronika: Nauka, Tekhnologiya, BiznesElektronika: Nauka, Tekhnologiya, BiznesЭлектроника: наука, технология, бизнес1992-41781992-4186Technosphera JSC70659010.22184/1992-4178.2026.255.3.158.162Manufacturing technologiesПроизводственные технологииResearch ArticleLTCC today and the technology development trendsLTCC сегодня и тенденции развития технологииKhokhlunS.ХохлунС.
Russian Federation

инженер-технолог

kys@electronics.ruSidorovA.СидоровА.
Russian Federation

начальник отдела сервиса

kys@electronics.ruООО «АК Микротех»2304202631581622204202622042026Copyright ©; 2026, Khokhlun S., Sidorov A.Copyright ©; 2026, Хохлун С., Сидоров А.2026Khokhlun S., Sidorov A.Хохлун С., Сидоров А.https://journals.eco-vector.com/1992-4178/about/submissionshttps://journals.eco-vector.com/1992-4178/article/view/706590

The article examines the current state of LTCC technology as an industrially mature platform for the production of multilayer ceramic modules. It also analyzes the factors determining the technology’s relevance in the next decade and the main areas of its development.

В статье рассмотрено современное состояние технологии LTCC как промышленно зрелой платформы для производства многослойных керамических модулей. Проанализированы факторы, определяющие актуальность технологии в ближайшее десятилетие, а также основные направления ее развития.

LTCC technologymicrowave and power electronicsmultilayer ceramic modulecold sintering processтехнология LTCCСВЧ- и силовая электроникамногослойный керамический модульпроцесс холодного спеканияLiu C., Xu M., Kang X., Guo J., Zhang B., Wang H., Xu X., Jin H., Wang H. Advances in Low-Temperature Co-Fired Ceramics for Next-Generation Electronics Applications // https://pubmed.ncbi.nlm.nih.gov/41482688/.DuPont. DuPont GreenTape 951 Low Temperature Cofire Ceramic (LTCC) System: Technical Data Sheet // https://www.etsmtl.ca/uploads/Dupont_951.pdf.Kyocera. LTCC Technology for mmWave: Data sheet // https://germany.kyocera.com/uploads/eu/Data_sheet_SC_LTCC_Technology_for_mmWave_210723.pdf.Ferro. A6M / A6M-E: LTCC System. Technical Data Sheet // https://www.etsmtl.ca/uploads/Ferro_A6M.pdf.Sešek A., Makarovič K. Metallization, Material Selection, and Bonding of Interconnections for Novel LTCC and HTCC Power Modules // Materials. 2022. Vol. 15. No. 3. Art. 1036.Graddy P., Beikmohamadi A., Nair D., Thrasher B. Reliability of LTCC Using Electroless Nickel Immersion Gold (ENIG) Plating Technology // https://imapsource.org/api/v1/articles/57104-reliability-of-ltcc-using-electroless-nickel-immersion-gold-enig-plating-technology.pdf.Wang S., Hou T., Huo R., Chen Z., Zeng Q., He Y., Zhao Y., Liu X. Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits // Materials. 2023. Vol. 16, No. 20. Art. 6720.Lin J.-Jr., Lin C.-I., Kao T.-H., Huang M.-C. Low-Temperature Metallization and Laser Trimming Process for Microwave Dielectric Ceramic Filters // Materials. 2021.Yao Y., Chen C., Fu S., Jia Q., Wang W., Zeng H. Anti-oxidation copper powder with constructed calcium silicate hydrate nano-barrier layer for printable electrode paste // Surfaces and Interfaces. 2025. Vol. 65. Art. 106496.Shahbazi S., Grabey S., Persons R. A Low Firing Temperature Copper Conductor for Use on an Aluminum Metal Compatible Dielectric in LED Thermal Substrate Applications // https://imapsource.org/article/57183-a-low-firing-temperature-copper-conductor-for-use-on-an-aluminum-metal-compatible-dielectric-in-led-thermal-substrate-applications.pdf.Heraeus. C7401 Thick Film Copper Conductor: Technical Data Sheet // https://pim.heraeus.com/datasheets/HET/TFM/C7401.pdf.Shuwen L., Mingsheng M., Feng L., Zhifu L. Corrosion Behavior and Mechanism of LTCC Materials in Ca-B-Si System // Journal of Inorganic Materials. 2023. Vol. 38(5). PP. 553–560.