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<article xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:ali="http://www.niso.org/schemas/ali/1.0/" article-type="research-article" dtd-version="1.2" xml:lang="en"><front><journal-meta><journal-id journal-id-type="publisher-id">Elektronika: Nauka, Tekhnologiya, Biznes</journal-id><journal-title-group><journal-title xml:lang="en">Elektronika: Nauka, Tekhnologiya, Biznes</journal-title><trans-title-group xml:lang="ru"><trans-title>Электроника: наука, технология, бизнес</trans-title></trans-title-group></journal-title-group><issn publication-format="print">1992-4178</issn><issn publication-format="electronic">1992-4186</issn><publisher><publisher-name xml:lang="en">Technosphera JSC</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="publisher-id">706592</article-id><article-id pub-id-type="doi">10.22184/1992-4178.2026.255.3.164.169</article-id><article-categories><subj-group subj-group-type="toc-heading" xml:lang="en"><subject>Manufacturing technologies</subject></subj-group><subj-group subj-group-type="toc-heading" xml:lang="ru"><subject>Производственные технологии</subject></subj-group><subj-group subj-group-type="article-type"><subject>Research Article</subject></subj-group></article-categories><title-group><article-title xml:lang="en">Silicon carbide for power ICs: fabrication of wafers with epitaxial layers</article-title><trans-title-group xml:lang="ru"><trans-title>Карбид кремния для силовых микросхем: изготовление пластин с эпитаксиальным слоем</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author"><name-alternatives><name xml:lang="en"><surname>Ivanov</surname><given-names>V.</given-names></name><name xml:lang="ru"><surname>Иванов</surname><given-names>В.</given-names></name></name-alternatives><address><country country="RU">Russian Federation</country></address><bio xml:lang="ru"><p>начальник технического отдела</p></bio><email>vi@ttmicro.ru</email><xref ref-type="aff" rid="aff1"/></contrib></contrib-group><aff-alternatives id="aff1"><aff><institution xml:lang="en"></institution></aff><aff><institution xml:lang="ru">ООО «ТТМ»</institution></aff></aff-alternatives><pub-date date-type="pub" iso-8601-date="2026-04-23" publication-format="electronic"><day>23</day><month>04</month><year>2026</year></pub-date><issue>3</issue><issue-title xml:lang="en"/><issue-title xml:lang="ru"/><fpage>164</fpage><lpage>169</lpage><history><date date-type="received" iso-8601-date="2026-04-22"><day>22</day><month>04</month><year>2026</year></date><date date-type="accepted" iso-8601-date="2026-04-22"><day>22</day><month>04</month><year>2026</year></date></history><permissions><copyright-statement xml:lang="en">Copyright ©; 2026, Ivanov V.</copyright-statement><copyright-statement xml:lang="ru">Copyright ©; 2026, Иванов В.</copyright-statement><copyright-year>2026</copyright-year><copyright-holder xml:lang="en">Ivanov V.</copyright-holder><copyright-holder xml:lang="ru">Иванов В.</copyright-holder><license><ali:license_ref xmlns:ali="http://www.niso.org/schemas/ali/1.0/">https://journals.eco-vector.com/1992-4178/about/submissions</ali:license_ref></license></permissions><self-uri xlink:href="https://journals.eco-vector.com/1992-4178/article/view/706592">https://journals.eco-vector.com/1992-4178/article/view/706592</self-uri><abstract xml:lang="en"><p>The paper describes the first three stages of the silicon carbide-based integrated circuit manufacturing cycle: single crystal growth, wafer fabrication and epitaxy. An overview of current technological solutions and equipment used at these stages is presented.</p></abstract><trans-abstract xml:lang="ru"><p>В работе описываются первые три этапа технологического цикла производства микросхем на основе карбида кремния – выращивание монокристаллов, изготовление пластин и эпитаксия. Приведен обзор современных технологических решений и оборудования.</p></trans-abstract><kwd-group xml:lang="en"><kwd>silicon carbide</kwd><kwd>power components</kwd><kwd>single crystal growth</kwd><kwd>cutting</kwd><kwd>epitaxy</kwd></kwd-group><kwd-group xml:lang="ru"><kwd>карбид кремния</kwd><kwd>силовые компоненты</kwd><kwd>рост монокристалла</kwd><kwd>резка</kwd><kwd>эпитаксия</kwd></kwd-group><funding-group/></article-meta></front><body></body><back><ref-list><ref id="B1"><label>1.</label><mixed-citation>Ostling M., Koo S.-M., Lee S.-K. et al. SiC device technology for high voltage and RF power applications // 23rd International Conference on Microelectronics. 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