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<article xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:ali="http://www.niso.org/schemas/ali/1.0/" article-type="review-article" dtd-version="1.2" xml:lang="en"><front><journal-meta><journal-id journal-id-type="publisher-id">Elektronika: Nauka, Tekhnologiya, Biznes</journal-id><journal-title-group><journal-title xml:lang="en">Elektronika: Nauka, Tekhnologiya, Biznes</journal-title><trans-title-group xml:lang="ru"><trans-title>Электроника: наука, технология, бизнес</trans-title></trans-title-group></journal-title-group><issn publication-format="print">1992-4178</issn><issn publication-format="electronic">1992-4186</issn><publisher><publisher-name xml:lang="en">Technosphera JSC</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="publisher-id">706594</article-id><article-id pub-id-type="doi">10.22184/1992-4178.2026.255.3.170.174</article-id><article-categories><subj-group subj-group-type="toc-heading" xml:lang="en"><subject>Manufacturing technologies</subject></subj-group><subj-group subj-group-type="toc-heading" xml:lang="ru"><subject>Производственные технологии</subject></subj-group><subj-group subj-group-type="article-type"><subject>Review Article</subject></subj-group></article-categories><title-group><article-title xml:lang="en">Reverse engineering of modern ICs</article-title><trans-title-group xml:lang="ru"><trans-title>Реверс-инжиниринг современных микросхем</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author"><name-alternatives><name xml:lang="en"><surname>Borisov</surname><given-names>E.</given-names></name><name xml:lang="ru"><surname>Борисов</surname><given-names>Е.</given-names></name></name-alternatives><address><country country="RU">Russian Federation</country></address><bio xml:lang="ru"><p>директор по продажам и маркетингу</p></bio><email>kys@electronics.ru</email><xref ref-type="aff" rid="aff1"/></contrib></contrib-group><aff-alternatives id="aff1"><aff><institution xml:lang="en"></institution></aff><aff><institution xml:lang="ru">ООО «МС Микротех»</institution></aff></aff-alternatives><pub-date date-type="pub" iso-8601-date="2026-04-23" publication-format="electronic"><day>23</day><month>04</month><year>2026</year></pub-date><issue>3</issue><issue-title xml:lang="en"/><issue-title xml:lang="ru"/><fpage>170</fpage><lpage>174</lpage><history><date date-type="received" iso-8601-date="2026-04-22"><day>22</day><month>04</month><year>2026</year></date><date date-type="accepted" iso-8601-date="2026-04-22"><day>22</day><month>04</month><year>2026</year></date></history><permissions><copyright-statement xml:lang="en">Copyright ©; 2026, Borisov E.</copyright-statement><copyright-statement xml:lang="ru">Copyright ©; 2026, Борисов Е.</copyright-statement><copyright-year>2026</copyright-year><copyright-holder xml:lang="en">Borisov E.</copyright-holder><copyright-holder xml:lang="ru">Борисов Е.</copyright-holder><license><ali:license_ref xmlns:ali="http://www.niso.org/schemas/ali/1.0/">https://journals.eco-vector.com/1992-4178/about/submissions</ali:license_ref></license></permissions><self-uri xlink:href="https://journals.eco-vector.com/1992-4178/article/view/706594">https://journals.eco-vector.com/1992-4178/article/view/706594</self-uri><abstract xml:lang="en"><p>Reverse engineering is the process of analyzing chip to understand its design, structure and functionality. The article discusses modern methods and trends of reverse engineering in microelectronics.</p></abstract><trans-abstract xml:lang="ru"><p>Реверс-инжиниринг – это процесс анализа микросхемы с целью исследования ее конструкции, структуры, функциональности. В статье обсуждаются современные методы и тенденции развития реверс-инжиниринга в микроэлектронике.</p></trans-abstract><kwd-group xml:lang="en"><kwd>reverse engineering</kwd><kwd>chip decapsulation</kwd><kwd>scanning electron microscopy</kwd><kwd>focused ion beam system</kwd><kwd>electrical testing</kwd></kwd-group><kwd-group xml:lang="ru"><kwd>реверс-инжиниринг</kwd><kwd>декапсуляция микросхем</kwd><kwd>сканирующая электронная микроскопия</kwd><kwd>система сфокусированного ионного пучка</kwd><kwd>электрические испытания</kwd></kwd-group><funding-group/></article-meta></front><body></body><back><ref-list><ref id="B1"><label>1.</label><mixed-citation>Quadir S.E., Chen J., Forte D., Asadizanjani N., Shahbazmohamadi S., Wang L., Chandy J., Tehranipoor M. A Survey on Chip to System Reverse Engineering // ACM Journal on Emerging Technologies in Computing Systems (JETC). V. 13, Issue 1. PP. 1–34.</mixed-citation></ref><ref id="B2"><label>2.</label><mixed-citation>Youvan D.C. Decoding Silicon: Challenges and Strategies in the Reverse Engineering of Advanced Microchips // www.researchgate.net.</mixed-citation></ref><ref id="B3"><label>3.</label><mixed-citation>Nyako K., Dhakal U., Li F., Borra V. Trusted microelectronics: reverse engineering chip die using U-Net convolutional network // Engineering Research Express. 2024. V. 6. No. 4.</mixed-citation></ref><ref id="B4"><label>4.</label><mixed-citation>Torrance R., James D. Reverse Engineering in the Semiconductor Industry // IEEE 2007 Custom Intergrated Circuits Conference (CICC).</mixed-citation></ref><ref id="B5"><label>5.</label><mixed-citation>Torrance R., James D. The State-of-the-Art in IC Reverse Engineering // CHES '09: Proceedings of the 11th International Workshop on Cryptographic Hardware and Embedded Systems. PP. 363–381.</mixed-citation></ref></ref-list></back></article>
