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<article xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:ali="http://www.niso.org/schemas/ali/1.0/" article-type="research-article" dtd-version="1.2" xml:lang="en"><front><journal-meta><journal-id journal-id-type="publisher-id">Elektronika: Nauka, Tekhnologiya, Biznes</journal-id><journal-title-group><journal-title xml:lang="en">Elektronika: Nauka, Tekhnologiya, Biznes</journal-title><trans-title-group xml:lang="ru"><trans-title>Электроника: наука, технология, бизнес</trans-title></trans-title-group></journal-title-group><issn publication-format="print">1992-4178</issn><issn publication-format="electronic">1992-4186</issn><publisher><publisher-name xml:lang="en">Technosphera JSC</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="publisher-id">706604</article-id><article-id pub-id-type="doi">10.22184/1992-4178.2026.255.3.196.200</article-id><article-categories><subj-group subj-group-type="toc-heading" xml:lang="en"><subject>Problems and Solutions</subject></subj-group><subj-group subj-group-type="toc-heading" xml:lang="ru"><subject>Проблемы и решения</subject></subj-group><subj-group subj-group-type="article-type"><subject>Research Article</subject></subj-group></article-categories><title-group><article-title xml:lang="en">Engineering ethics in customer-supplier relationships</article-title><trans-title-group xml:lang="ru"><trans-title>Инженерная этика взаимоотношений заказчика и поставщика</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author"><name-alternatives><name xml:lang="en"><surname>Gnedash</surname><given-names>G.</given-names></name><name xml:lang="ru"><surname>Гнедаш</surname><given-names>Г.</given-names></name></name-alternatives><address><country country="RU">Russian Federation</country></address><email>kys@electronics.ru</email><xref ref-type="aff" rid="aff1"/></contrib><contrib contrib-type="author"><name-alternatives><name xml:lang="en"><surname>Vagin</surname><given-names>A.</given-names></name><name xml:lang="ru"><surname>Вагин</surname><given-names>А.</given-names></name></name-alternatives><address><country country="RU">Russian Federation</country></address><bio xml:lang="ru"><p>аспирант</p></bio><email>kys@electronics.ru</email><xref ref-type="aff" rid="aff1"/><xref ref-type="aff" rid="aff2"/></contrib></contrib-group><aff-alternatives id="aff1"><aff><institution xml:lang="en"></institution></aff><aff><institution xml:lang="ru">ООО «ТЕКВОС»</institution></aff></aff-alternatives><aff id="aff2"><institution>Национальный исследовательский Томский государственный университет</institution></aff><pub-date date-type="pub" iso-8601-date="2026-04-23" publication-format="electronic"><day>23</day><month>04</month><year>2026</year></pub-date><issue>3</issue><issue-title xml:lang="en"/><issue-title xml:lang="ru"/><fpage>196</fpage><lpage>200</lpage><history><date date-type="received" iso-8601-date="2026-04-22"><day>22</day><month>04</month><year>2026</year></date><date date-type="accepted" iso-8601-date="2026-04-22"><day>22</day><month>04</month><year>2026</year></date></history><permissions><copyright-statement xml:lang="en">Copyright ©; 2026, Gnedash G., Vagin A.</copyright-statement><copyright-statement xml:lang="ru">Copyright ©; 2026, Гнедаш Г., Вагин А.</copyright-statement><copyright-year>2026</copyright-year><copyright-holder xml:lang="en">Gnedash G., Vagin A.</copyright-holder><copyright-holder xml:lang="ru">Гнедаш Г., Вагин А.</copyright-holder><license><ali:license_ref xmlns:ali="http://www.niso.org/schemas/ali/1.0/">https://journals.eco-vector.com/1992-4178/about/submissions</ali:license_ref></license></permissions><self-uri xlink:href="https://journals.eco-vector.com/1992-4178/article/view/706604">https://journals.eco-vector.com/1992-4178/article/view/706604</self-uri><abstract xml:lang="en"><p>Given the limited supply of products from global manufacturers, it is important for Russian companies to ensure timely access to advanced microelectronic device packaging solutions. The article describes the interactions between the customer and supplier during the approval of the technical specifications and contract for the supply of packages for microelectronics.</p></abstract><trans-abstract xml:lang="ru"><p>В условиях ограничения поставок продукции от мировых производителей российским предприятиям важно обеспечить своевременный доступ к передовым решениям в области корпусирования микроэлектронных устройств. В статье описан порядок взаимодействия заказчика и поставщика на этапе согласования технического задания и договора на поставку корпусов для микроэлектроники.</p></trans-abstract><kwd-group xml:lang="en"><kwd>IC package</kwd><kwd>technical specifications</kwd></kwd-group><kwd-group xml:lang="ru"><kwd>корпус для ИС</kwd><kwd>техническое задание</kwd></kwd-group><funding-group/></article-meta></front><body></body><back><ref-list/></back></article>
