Economy + busyness

期	标题	文件
编号 3 (224) (2023)	Experience practice with chinese component suppliers: how to avoid risks	(Rus)
Novotorzhentsev D.
编号 3 (224) (2023)	Microelectronics: development of the production facilities, sales of equipment and EUV lithography	(Rus)
Makushin М.
编号 2 (223) (2023)	CHIPS Act and some aspects of improving the US R&D ecosystem	(Rus)
Avdonin B., Makushin M.
编号 2 (223) (2023)	Globalization and monopolization of microelectronics in current conditions	(Rus)
Shelepin N.
编号 1 (232) (2024)	Development of chemical materials market for microelectronics in Russia: Problems and prospects	(Rus)
Kniga O.
编号 1 (222) (2023)	New opportunities for contract design and manufacturing services: how they arise and how to take advantage of them	(Rus)
Tishkin S., Moskovko I.
编号 1 (222) (2023)	Contract manufacturing of iсs. The world's leading silicon fabs increase capacities	(Rus)
Makushin M.
编号 8 (229) (2023)	Microelectronics: CHIPS Act and expansion of the US manufacturing base	(Rus)
Avdonin B., Makushin M.
编号 6 (227) (2023)	Difficulties in implementing the chips act in the US	(Rus)
Avdonin B., Makushin M.
编号 4 (225) (2023)	How do we develop domestic microelectronics: 2023	(Rus)
Enns V.
编号 4 (225) (2023)	Analysis of promising areas for creation an innovative business in Russian Federation	(Rus)
Levalds Y.
编号 4 (225) (2023)	Semiconductors: sales forecasts and development aspects	(Rus)
Makushin M.
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