Elektronika: Nauka, Tekhnologiya, Biznes
ISSN 1992-4178 (Print)
ISSN 1992-4186 (Online)
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metal-ceramic package
multilayer ceramic capacitor
printed circuit boards
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shape defects
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Author Details
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Ханин, А.
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No 8 (229) (2023)
Test and measurement
Features of measuring the MIS-HEMT DIE-package thermal resistance
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