| Issue |
Title |
File |
| No 6 (227) (2023) |
50–75 GHZ and 75–110 GHZ domestic expansion modules for vector network analyzers |
|
|
Muravyov V., Zarezin A., Titenko A., Bobova V., Sinogin M., Kukushkin I., Zaostrovnykh S.
|
| No 3 (234) (2024) |
60 years in microelectronics |
|
|
Kovalevsky Y.
|
| No 5 (236) (2024) |
6G network development aspectsю |
|
|
Makushin M.
|
| No 3 (224) (2023) |
A comprehensive solution for materials mixing and dispensing
Visit to “Weltplast” and NTF “Techno-Alijans Elektroniks” |
|
|
Kovalevsky Y.
|
| No 4 (235) (2024) |
A look at the prospects for ultra-wideband solid-state radio electronics from 2024 |
|
|
Antsev G., Sarychev V.
|
| No 2 (233) (2024) |
Adjustable voltage output dc power supplies |
|
|
Vorontsov A.
|
| No 3 (234) (2024) |
Advanced connectors from «Elektrodetal» plant |
|
|
Gurov R., Gorkov A.
|
| No 2 (223) (2023) |
Algorithm for introducing compensation coefficients at out-of-round gage |
|
|
Epifantsev E.
|
| No 1 (232) (2024) |
An effective approach to designing a control machines for microprocessor cores |
|
|
Strogonov A.V., Bordyuzha O., Strogonov A.I.
|
| No 10 (231) (2023) |
An effective personnel strategy is a prerequisite for the leadership of «NIIME» JSC |
|
|
Polikarpova L.V., Sadkova N.V.
|
| No 10 (231) (2023) |
Analysis of contour and shape measurement results from multiple references during calibration |
|
|
Epifantsev K.
|
| No 4 (225) (2023) |
Analysis of promising areas for creation an innovative business in Russian Federation |
|
|
Levalds Y.
|
| No 5 (226) (2023) |
Analysis of the architecture of virtual hardware prototypes using SystemC |
|
|
Gavrilova D., Madumarov Т.
|
| No 1 (222) (2023) |
Antenna switches. Part 5 |
|
|
Kochemasov V., Safin A., Dinges S.
|
| No 2 (223) (2023) |
Antenna switches. Part 6 |
|
|
Kochemasov V., Safin A., Dinges S.
|
| No 1 (222) (2023) |
Application of algorithmic methods in the process of simulation modeling of technological processes |
|
|
Lijn E., Khomutskaya O., Vantsov S.
|
| No 3 (234) (2024) |
Application of computer vision systems in unmanned aerial vehicles: New opportunities for robotics |
|
|
Kalinovsky N.
|
| No 9 (230) (2023) |
Application of electric motors in robotics and medical equipment |
|
|
Averichev D.
|
| No 3 (234) (2024) |
Artificial intelligence as a tool of improving the production process at «ZPP» JSC |
|
|
Pozdeev V., Shugaepov S., Ermolaev E., Egoshin V.
|
| No 1 (222) (2023) |
Asset tracking is an element of the Consul system |
|
|
Skiba E.
|
| No 4 (225) (2023) |
Available inductive components on the Russian market |
|
|
Krupnov I.
|
| No 2 (223) (2023) |
Bench-top automatic machine for gold wire mounting by ball-wedge method |
|
|
Petukhov I., Letunovich E.
|
| No 4 (225) (2023) |
Business program events of ExpoElectronica 2023. Part 1 |
|
|
Kovalevsky Y.
|
| No 5 (226) (2023) |
Business program events of ExpoElectronica 2023. Part 2 |
|
|
Kovalevsky Y.
|
| No 1 (222) (2023) |
Changes to the All-Russian Product Classification regarding radio-electronic products |
|
|
Editorial B.
|
| No 3 (234) (2024) |
Changing a contractor during 1C:ERP adoption: How to minimize risks |
|
|
Rogozina Y., Kuznetsova E.
|
| No 2 (223) (2023) |
Characteristics of silicon cantilevers for atomic force microscopy from Angstrem JSC |
|
|
Novak A., Sokolov A., Kovalev V.
|
| No 10 (231) (2023) |
Chasing excellence: from deep machine learning to artificial intelligence in maker- ray aoi systems. Part 1 |
|
|
Rozhkov I., Garanin A., Podolsky D.
|
| No 3 (234) (2024) |
Chasing excellence: from deep machine learning to artificial intelligence in Maker-Ray AOI systems. Part 2 |
|
|
Rozhkov I., Garanin A., Podolsky D.
|
| No 2 (233) (2024) |
ChemSonic are new generation ultrasonic baths |
|
|
Koval Y.
|
| No 8 (229) (2023) |
Chiplets and heterogeneous integration as a basic technology stack capable of ensuring the sovereignty of domestic electronics in a new technological order |
|
|
Achkasov A.
|
| No 2 (223) (2023) |
CHIPS Act and some aspects of improving the US R&D ecosystem |
|
|
Avdonin B., Makushin M.
|
| No 7 (228) (2023) |
Civil products by NIIET JSC: from transistors and microcontrollers to chargers |
|
|
Maleev V.
|
| No 3 (234) (2024) |
Computer modules: application advantages and popular standards as exemplified by NPK «ATRONIK» products |
|
|
Medvedev A.
|
| No 3 (234) (2024) |
Computer vision systems at industrial enterprises |
|
|
Shupov A.
|
| No 5 (226) (2023) |
Connectors for unmanned systems |
|
|
Perminov P.
|
| No 3 (234) (2024) |
Contact devices for testing electronic components are reliable solutions from «IC Socket» |
|
|
Kapshunova Y., Kolochkov S.
|
| No 7 (228) (2023) |
Contacting devices and carriers from ZPP JSC for IC testing |
|
|
Shugaepov S., Ermolaev E., Egoshin V., Magidov E.
|
| No 5 (236) (2024) |
Continuous indoor and outdoor navigation for robotic logistics |
|
|
Starovoitov E., Skiba E.
|
| No 1 (222) (2023) |
Contract manufacturing of iсs. The world's leading silicon fabs increase capacities |
|
|
Makushin M.
|
| No 1 (222) (2023) |
Contract manufacturing service at ZPP JSC, its risks and benefits |
|
|
Shakirova E., Shugaepov S., Ermolaev E., Egoshin V.
|
| No 10 (231) (2023) |
Coordination center “staffing support for microelectronics”: tasks, functions, planned results |
|
|
Pereverzev A., Balashov A., Kozlov A.
|
| No 4 (225) (2023) |
Corebai Microelectronics Chinese semiconductor developer: product overview |
|
|
Sadekov D.
|
| No 3 (234) (2024) |
Current trends in packaging leadless metal-polymer packages |
|
|
Abashin E., Alekhin S., Gavrilin A., Dantsev O.
|
| No 4 (225) (2023) |
Current trends in the improvement of magnetic focusing systems |
|
|
Jihad Z., Shvachko A.
|
| No 1 (222) (2023) |
DC analysis of electrical circuits by the Newton - Raphson method |
|
|
Strogonov A.
|
| No 1 (222) (2023) |
Dedicated metal-ceramic packages with integrated and local radiation shields |
|
|
Alontsev A., Grabchikov S.
|
| No 6 (227) (2023) |
Deepening self-diagnosis of test and verification equipment of control systems: migration from Windows to Linux |
|
|
Belov S.
|
| No 4 (235) (2024) |
Design and simulation of microwave filter with flip-chip contacts |
|
|
Skovorodnikov S., Semenov D.
|
| No 5 (236) (2024) |
Design of an electronic board for a dew point temperature converter |
|
|
Mihin S., Koshkur O., Ganzha V., Romanov A.
|
| No 9 (230) (2023) |
Design of monolithic F-class microwave amplifiers |
|
|
Dudinov K., Zadnepryanaya N.
|
| No 5 (236) (2024) |
Design of radio-photonic equipment based on optical and microwave electronics technologies |
|
|
Belkin M., Vasiliev M., Klyushnik D., Kuznetsov E.
|
| No 3 (224) (2023) |
Designing finite-state machine in Matlab / Simulink system’s Stateflow tool with subsequent implementation at the FPGA basis |
|
|
Strogonov А.
|
| No 3 (234) (2024) |
Development of AMR converter mathematical model for implementation in CAD |
|
|
Cheplakov A., Litvinenko E.
|
| No 1 (232) (2024) |
Development of chemical materials market for microelectronics in Russia: Problems and prospects |
|
|
Kniga O.
|
| No 2 (233) (2024) |
Development of dielectric heat-conducting film adhesive material for the needs of electronics – domestic experience |
|
|
Egorov A., Danilov E., Ivanov A., Gurova E., Romanov N., Gareev A., Khripunova Y.
|
| No 1 (232) (2024) |
Development of domestic CAD systems for microelectronics design based on the Delta Design platform |
|
|
Malyshev N.
|
| No 5 (226) (2023) |
Development of leadless metal-ceramic packages for wide use in ZPP JSC |
|
|
Ermilov R., Shugaepov S., Ermolaev Е., Egoshin V.
|
| No 7 (228) (2023) |
Development requires close interaction between component manufacturers, product developers and end users, and government |
|
|
Gurbashkov M.
|
| No 6 (227) (2023) |
Difficulties in implementing the chips act in the US |
|
|
Avdonin B., Makushin M.
|
| No 7 (228) (2023) |
Domestic chip resistors adapted to the requirements of the AEC-Q200 standard and environmental directives |
|
|
Malyshev I., Eremeev Y., Belkov I.
|
| No 6 (227) (2023) |
Domestic electronic components and modules for robotics |
|
|
Starovoitov E., Skiba E.
|
| No 9 (230) (2023) |
Domestic lead-acid batteries for communications infrastructure and electric power industry |
|
|
Emelianenko S.
|
| No 10 (231) (2023) |
Domestic materials and equipment for bare boards – experience exchange and discussion of industry development prospects “RUSCON 2023” science conference of bare boards manufacturers |
|
|
Kovalevsky Y.S.
|
| No 10 (231) (2023) |
Domestic smarc computer modules overview |
|
|
Medvedev A.
|
| No 6 (227) (2023) |
Double-gap klystron photonic crystal resonator with additional planar resonant elements |
|
|
Gnusarev A., Miroshnichenko A., Tsarev V., Akafyeva N.
|
| No 3 (234) (2024) |
Electric motors for domestic robotics and unmanned vehicles |
|
|
Dudorov E., Kuvshinov D.
|
| No 10 (231) (2023) |
Electric motors in the automotive industry |
|
|
Averichev D., Berezina Y.
|
| No 2 (223) (2023) |
Electrolytic anodizing of silicon, silicon carbide and silicon nitride for nanotechnology purposes (review) |
|
|
Makharinets A., Mileshko L.
|
| No 6 (227) (2023) |
Electromagnetic compatibility assurance in the context of changing technologies and market
“EMC” the 12th all-Russia science and technology conference |
|
|
Kovalevsky Y.
|
| No 7 (228) (2023) |
Electromagnetic compatibility test |
|
|
Grishin D.
|
| No 2 (233) (2024) |
Electromagnetic compatibility tests |
|
|
Gusev I., Faizullaev V.
|
| No 9 (230) (2023) |
Electromechanical components from ZPP JSC |
|
|
Rybakov D.
|
| No 8 (229) (2023) |
Electronic components for rocket and space industry and not only that. “ECB-2023” the 12th All-Russia Science and Technology Conference |
|
|
Kovalevsky Y.
|
| No 3 (234) (2024) |
Electronic components from JSC «Zavod Rekond» |
|
|
Smirnovsky S., Andzhanovskaya Y.
|
| No 7 (228) (2023) |
Electronic identification devices from Angstrem JSC |
|
|
Shisharin A., Davydov A.
|
| No 4 (225) (2023) |
Electronic quality diamond. Innovation. Investments. Creative projects |
|
|
Luchinin V., Kolyadin A., Yagudaev Y., Ilyin S.
|
| No 7 (228) (2023) |
Electro-optical properties of polymer-dispersed liquid crystals doped with nanoparticles |
|
|
Belyaev V., Avdeenkov V.
|
| No 7 (228) (2023) |
End-to-end cycle of creating sensors and signal processing devices: from requirements specifications to serial production |
|
|
Polevikov V.
|
| No 5 (226) (2023) |
End-to-end production cycle of microwave products unique on the Russian market Visit to production facility of SDS Electronics |
|
|
Kovalevsky Y.
|
| No 5 (226) (2023) |
Engineering approach to the selection of new manufacturers of microwave components from China |
|
|
Konakov S.
|
| No 3 (224) (2023) |
Enhancement of legislation for contract system and procurement procedures |
|
|
Kovalevsky Y.
|
| No 2 (233) (2024) |
Enhancement of legislation for price setting of products supplied under the state defense order |
|
|
Kovalevsky Y.
|
| No 1 (222) (2023) |
Enhancement of legislation for state defense order. Meeting of the military and industrial policy and budget Section of the Expert council of the Federation Council Committee on defense and security |
|
|
Kovalevsky Y.
|
| No 3 (224) (2023) |
Equipment and materials for the manufacture of metal parts at ZPP JSC |
|
|
Polyanin А., Shugaepov S., Ermolaev Е., Egoshin V.
|
| No 6 (227) (2023) |
Expanded line of PR1-25 high-power coaxial RF and microwave resistive absorbers |
|
|
Malyshev I., Eremeev Y., Belkov I.
|
| No 10 (231) (2023) |
Experience practice in organizing interaction between NIIMA «Progress» JSC and universities to attract personnel |
|
|
Kirik D.
|
| No 3 (224) (2023) |
Experience practice with chinese component suppliers: how to avoid risks |
|
|
Novotorzhentsev D.
|
| No 5 (226) (2023) |
Expert Electronics research and production company |
|
|
Editorial B.
|
| No 2 (223) (2023) |
ExpoElectronica 2023 international anniversary exhibition – new sections, new opportunities for exhibitors and visitors |
|
|
Mangusheva R.
|
| No 2 (233) (2024) |
ExpoElectronica 2024 international exhibition – new sections, new companies, new opportunities for participants and visitors |
|
|
Mangusheva R.
|
| No 6 (227) (2023) |
External factors resistance and reliability of metal-ceramic packages |
|
|
Shugaepov S., Ermolaev E., Egoshin V., Sabirova E.
|
| No 8 (229) (2023) |
Features of measuring the MIS-HEMT DIE-package thermal resistance |
|
|
Strogonov A., Kharchenko M., Khanin A.
|
| No 5 (236) (2024) |
Features of the designing and manufacturing technology of mm-wavelength connectors |
|
|
Dzhurinsky K.
|
| No 3 (234) (2024) |
Fiber-optic gyroscopes and systems based on them. Part 1 |
|
|
Berezina Y.
|
| No 4 (235) (2024) |
Fiber-optic gyroscopes and systems based on them. Part 2 |
|
|
Berezina Y.
|
| No 3 (234) (2024) |
FLEX after a lapse of a year and a half: Practice confirms the demand for solutions for the rapid building of balanced production facilities |
|
|
Lipkin E., Gogin O.
|
| No 5 (236) (2024) |
Foreign and domestic multilayer ceramic capacitors: technologies, quality categories |
|
|
Savitsky V., Raskin A.
|
| No 10 (231) (2023) |
Formation of a data package of coordinate measurements in shape, contour, location control tools |
|
|
Epifantsev K.
|
| No 1 (232) (2024) |
Formulation of Russian passive electronic components road map |
|
|
Kovalevsky Y.
|
| 1 - 100 of 274 Items |
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