| Issue |
Title |
File |
| No 3 (234) (2024) |
60 years in microelectronics |
|
|
Kovalevsky Y.
|
| No 3 (224) (2023) |
A comprehensive solution for materials mixing and dispensing
Visit to “Weltplast” and NTF “Techno-Alijans Elektroniks” |
|
|
Kovalevsky Y.
|
| No 2 (233) (2024) |
Adjustable voltage output dc power supplies |
|
|
Vorontsov A.
|
| No 3 (234) (2024) |
Advanced connectors from «Elektrodetal» plant |
|
|
Gurov R., Gorkov A.
|
| No 2 (223) (2023) |
Algorithm for introducing compensation coefficients at out-of-round gage |
|
|
Epifantsev E.
|
| No 1 (232) (2024) |
An effective approach to designing a control machines for microprocessor cores |
|
|
Strogonov A.V., Bordyuzha O., Strogonov A.I.
|
| No 4 (225) (2023) |
Analysis of promising areas for creation an innovative business in Russian Federation |
|
|
Levalds Y.
|
| No 1 (222) (2023) |
Antenna switches. Part 5 |
|
|
Kochemasov V., Safin A., Dinges S.
|
| No 2 (223) (2023) |
Antenna switches. Part 6 |
|
|
Kochemasov V., Safin A., Dinges S.
|
| No 1 (222) (2023) |
Application of algorithmic methods in the process of simulation modeling of technological processes |
|
|
Lijn E., Khomutskaya O., Vantsov S.
|
| No 3 (234) (2024) |
Application of computer vision systems in unmanned aerial vehicles: New opportunities for robotics |
|
|
Kalinovsky N.
|
| No 3 (234) (2024) |
Artificial intelligence as a tool of improving the production process at «ZPP» JSC |
|
|
Pozdeev V., Shugaepov S., Ermolaev E., Egoshin V.
|
| No 1 (222) (2023) |
Asset tracking is an element of the Consul system |
|
|
Skiba E.
|
| No 4 (225) (2023) |
Available inductive components on the Russian market |
|
|
Krupnov I.
|
| No 2 (223) (2023) |
Bench-top automatic machine for gold wire mounting by ball-wedge method |
|
|
Petukhov I., Letunovich E.
|
| No 4 (225) (2023) |
Business program events of ExpoElectronica 2023. Part 1 |
|
|
Kovalevsky Y.
|
| No 1 (222) (2023) |
Changes to the All-Russian Product Classification regarding radio-electronic products |
|
|
Editorial B.
|
| No 3 (234) (2024) |
Changing a contractor during 1C:ERP adoption: How to minimize risks |
|
|
Rogozina Y., Kuznetsova E.
|
| No 2 (223) (2023) |
Characteristics of silicon cantilevers for atomic force microscopy from Angstrem JSC |
|
|
Novak A., Sokolov A., Kovalev V.
|
| No 3 (234) (2024) |
Chasing excellence: from deep machine learning to artificial intelligence in Maker-Ray AOI systems. Part 2 |
|
|
Rozhkov I., Garanin A., Podolsky D.
|
| No 2 (233) (2024) |
ChemSonic are new generation ultrasonic baths |
|
|
Koval Y.
|
| No 2 (223) (2023) |
CHIPS Act and some aspects of improving the US R&D ecosystem |
|
|
Avdonin B., Makushin M.
|
| No 3 (234) (2024) |
Computer modules: application advantages and popular standards as exemplified by NPK «ATRONIK» products |
|
|
Medvedev A.
|
| No 3 (234) (2024) |
Computer vision systems at industrial enterprises |
|
|
Shupov A.
|
| No 3 (234) (2024) |
Contact devices for testing electronic components are reliable solutions from «IC Socket» |
|
|
Kapshunova Y., Kolochkov S.
|
| No 1 (222) (2023) |
Contract manufacturing of iсs. The world's leading silicon fabs increase capacities |
|
|
Makushin M.
|
| No 1 (222) (2023) |
Contract manufacturing service at ZPP JSC, its risks and benefits |
|
|
Shakirova E., Shugaepov S., Ermolaev E., Egoshin V.
|
| No 4 (225) (2023) |
Corebai Microelectronics Chinese semiconductor developer: product overview |
|
|
Sadekov D.
|
| No 3 (234) (2024) |
Current trends in packaging leadless metal-polymer packages |
|
|
Abashin E., Alekhin S., Gavrilin A., Dantsev O.
|
| No 4 (225) (2023) |
Current trends in the improvement of magnetic focusing systems |
|
|
Jihad Z., Shvachko A.
|
| No 1 (222) (2023) |
DC analysis of electrical circuits by the Newton - Raphson method |
|
|
Strogonov A.
|
| No 1 (222) (2023) |
Dedicated metal-ceramic packages with integrated and local radiation shields |
|
|
Alontsev A., Grabchikov S.
|
| No 3 (224) (2023) |
Designing finite-state machine in Matlab / Simulink system’s Stateflow tool with subsequent implementation at the FPGA basis |
|
|
Strogonov А.
|
| No 3 (234) (2024) |
Development of AMR converter mathematical model for implementation in CAD |
|
|
Cheplakov A., Litvinenko E.
|
| No 1 (232) (2024) |
Development of chemical materials market for microelectronics in Russia: Problems and prospects |
|
|
Kniga O.
|
| No 2 (233) (2024) |
Development of dielectric heat-conducting film adhesive material for the needs of electronics – domestic experience |
|
|
Egorov A., Danilov E., Ivanov A., Gurova E., Romanov N., Gareev A., Khripunova Y.
|
| No 1 (232) (2024) |
Development of domestic CAD systems for microelectronics design based on the Delta Design platform |
|
|
Malyshev N.
|
| No 3 (234) (2024) |
Electric motors for domestic robotics and unmanned vehicles |
|
|
Dudorov E., Kuvshinov D.
|
| No 2 (223) (2023) |
Electrolytic anodizing of silicon, silicon carbide and silicon nitride for nanotechnology purposes (review) |
|
|
Makharinets A., Mileshko L.
|
| No 2 (233) (2024) |
Electromagnetic compatibility tests |
|
|
Gusev I., Faizullaev V.
|
| No 3 (234) (2024) |
Electronic components from JSC «Zavod Rekond» |
|
|
Smirnovsky S., Andzhanovskaya Y.
|
| No 4 (225) (2023) |
Electronic quality diamond. Innovation. Investments. Creative projects |
|
|
Luchinin V., Kolyadin A., Yagudaev Y., Ilyin S.
|
| No 3 (224) (2023) |
Enhancement of legislation for contract system and procurement procedures |
|
|
Kovalevsky Y.
|
| No 2 (233) (2024) |
Enhancement of legislation for price setting of products supplied under the state defense order |
|
|
Kovalevsky Y.
|
| No 1 (222) (2023) |
Enhancement of legislation for state defense order. Meeting of the military and industrial policy and budget Section of the Expert council of the Federation Council Committee on defense and security |
|
|
Kovalevsky Y.
|
| No 3 (224) (2023) |
Equipment and materials for the manufacture of metal parts at ZPP JSC |
|
|
Polyanin А., Shugaepov S., Ermolaev Е., Egoshin V.
|
| No 3 (224) (2023) |
Experience practice with chinese component suppliers: how to avoid risks |
|
|
Novotorzhentsev D.
|
| No 2 (223) (2023) |
ExpoElectronica 2023 international anniversary exhibition – new sections, new opportunities for exhibitors and visitors |
|
|
Mangusheva R.
|
| No 2 (233) (2024) |
ExpoElectronica 2024 international exhibition – new sections, new companies, new opportunities for participants and visitors |
|
|
Mangusheva R.
|
| No 3 (234) (2024) |
Fiber-optic gyroscopes and systems based on them. Part 1 |
|
|
Berezina Y.
|
| No 3 (234) (2024) |
FLEX after a lapse of a year and a half: Practice confirms the demand for solutions for the rapid building of balanced production facilities |
|
|
Lipkin E., Gogin O.
|
| No 1 (232) (2024) |
Formulation of Russian passive electronic components road map |
|
|
Kovalevsky Y.
|
| No 1 (222) (2023) |
Gallium nitride microwave components: what has changed in two years |
|
|
Kishchinsky A., Minnebaev V.
|
| No 2 (233) (2024) |
Generating and studying amplitude-frequency modulation signals using Rigol devices |
|
|
Lemeshko N., Gorelkin M.
|
| No 2 (223) (2023) |
Globalization and monopolization of microelectronics in current conditions |
|
|
Shelepin N.
|
| No 1 (222) (2023) |
History of rf connectors. general purpose connectors. Part 1 |
|
|
Djurinsky K.
|
| No 2 (223) (2023) |
History of rf connectors. General purpose connectors. Part 2 |
|
|
Djurinsky K.
|
| No 3 (224) (2023) |
History of RF connectors. Instrument and metrology connectors |
|
|
Djurinsky К.
|
| No 4 (225) (2023) |
How do we develop domestic microelectronics: 2023 |
|
|
Enns V.
|
| No 4 (225) (2023) |
How to correctly choose and optimally apply vector network analysers. “Fundamentals of measurement” workshop |
|
|
Kovalevsky Y.
|
| No 3 (234) (2024) |
How to create a clean production room. Technologies and equipment |
|
|
Usatov A., Lyakhov P.
|
| No 3 (224) (2023) |
How to defeat the dragon: implementation of 1C:ERP in the contract manufacturing of electronics using the Agile methodology |
|
|
Rogozina Y., Kuznetsova E.
|
| No 1 (232) (2024) |
Human capital in the field of microwave measurement: demands and ways to meet them |
|
|
Kovalevsky Y.
|
| No 2 (233) (2024) |
Improving the reliability characteristics of multi-lead metal-ceramic packages from ZPP JSC through the use of test systems |
|
|
Ermilov R., Shugaepov S., Ermolaev E., Egoshin V.
|
| No 2 (233) (2024) |
In the current conditions, one needs to permanently be at the ready |
|
|
Kutsko P.
|
| No 3 (234) (2024) |
In today’s world, navigation and communication will be inviolable factors in technological advantage and independence of the country |
|
|
Kondrashov Z.
|
| No 4 (225) (2023) |
Intelligent navigation of unmanned agricultural machinery |
|
|
Starovoitov E., Skiba E.
|
| No 2 (223) (2023) |
Investigation of the operation algorithm of the out-of-round gage centering system |
|
|
Epifantsev K.
|
| No 1 (222) (2023) |
It is exciting for us to dream and achieve dreams, discover new markets |
|
|
Yurov V.V.
|
| No 2 (233) (2024) |
It’s a perfect time for creating production facilities in Russia |
|
|
Avetisyan A.
|
| No 3 (234) (2024) |
KHARZA® modular drive is a new approach to solving problems |
|
|
Gurbashkov M.
|
| No 3 (234) (2024) |
KingTech is a new expert in the field of TFT LCD display production |
|
|
Pavlenko A.
|
| No 1 (222) (2023) |
Large-scale opportunities: the specifics of the Russian assembly service for consumer electronics - realities and market potential |
|
|
Lishik S.A.
|
| No 2 (223) (2023) |
LDMOS: the new products by NIIET JSC |
|
|
Alekseev R., Semeykin I., Tsotsorin A., Kurshev P.
|
| No 4 (225) (2023) |
Measuring shape defects with quaternion geometric transformation algorithms |
|
|
Epifantsev K.
|
| No 2 (233) (2024) |
Methodology for calculating the thermal conductivity coefficient of composite materials |
|
|
Tsionenko D., Kozlovsky I.
|
| No 2 (233) (2024) |
Methods for predicting ic durability based on parametric failures |
|
|
Strogonov A.
|
| No 2 (223) (2023) |
Microbolometers vacuum packaging |
|
|
Vidritsky A., Lanin V.
|
| No 3 (224) (2023) |
Microelectronics: development of the production facilities, sales of equipment and EUV lithography |
|
|
Makushin М.
|
| No 3 (234) (2024) |
Microwave ICs for on-board remote sensing equipment and space communication systems. Part 1 |
|
|
Starovoitov E., Skiba E., Nedashkovsky L.
|
| No 1 (232) (2024) |
Microwave switches controlled via USB, SPI and Ethernet interfaces |
|
|
Kochemasov V.
|
| No 1 (232) (2024) |
Minifabs in microelectronics: History and opportunities |
|
|
Khisamov A., Nazarenko A.
|
| No 3 (224) (2023) |
Navigation and telematics module line. LTE wireless modules |
|
|
Chikvarkin I.
|
| No 1 (232) (2024) |
Navigation in medical institutions: State-of-the-art technologies |
|
|
Starovoitov E., Skiba E.
|
| No 2 (223) (2023) |
Navigation in the city by stationary radio sources |
|
|
Starovoitov E., Skiba E.
|
| No 2 (223) (2023) |
New from Thinking Electronic: KRV series combined overvoltage and overcurrent protection devices |
|
|
Korotkov M.
|
| No 4 (225) (2023) |
New generation neutron spectrometer-dosimeter |
|
|
Rudnev P., Cheshigin I.
|
| No 4 (225) (2023) |
New metal-ceramic packages from ZPP JSC |
|
|
Shugaepov S., Ermolaev E., Egoshin V., Loskutova A., Sabirova E.
|
| No 1 (222) (2023) |
New opportunities for contract design and manufacturing services: how they arise and how to take advantage of them |
|
|
Tishkin S.A., Moskovko I.Y.
|
| No 3 (234) (2024) |
New products will increase our competitive advantage in the civilian market |
|
|
Sizikov A., Makhin D.
|
| No 3 (234) (2024) |
New workshop for «old» harnesses: features of production automation for lettered design documentation |
|
|
Fedintseva A.
|
| No 4 (225) (2023) |
Our customers receive the equipment not from a catalog, but exactly that they need |
|
|
Musaev S.S.
|
| No 3 (224) (2023) |
Our goal is to expand the range of domesticproducts and increase market share |
|
|
Myakochin Y.О.
|
| No 2 (223) (2023) |
Overview of SIT products |
|
|
Sadekov D.
|
| No 2 (233) (2024) |
Passive polyphase filters design methodology |
|
|
Nedashkovsky L., Repin V.
|
| No 3 (234) (2024) |
PCB high speed differential pairs for modular connector |
|
|
Shalomanov V., Bakanin D.
|
| No 1 (232) (2024) |
Plenary part of the “Microelectronics 2023” Russian forum |
|
|
Kovalevsky Y.
|
| No 2 (233) (2024) |
Possibility of using non-contact sensors to measure shape defects |
|
|
Epifantsev K.
|
| No 3 (224) (2023) |
R1-150M power resistors and HP1-82 resistor sets for use in power electronic modules |
|
|
Malyshev I., Eremeev Y., Mozulyakina Е.
|
| No 4 (225) (2023) |
Rationale for the use of a noise-suppressing circuit of a non-contact sensor for measuring geometry defects |
|
|
Epifantsev K.
|
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