Мақаланы E-mail арқылы жіберу Chiplets and heterogeneous integration as a basic technology stack capable of ensuring the sovereignty of domestic electronics in a new technological order
- Авторлар: Achkasov A.1
-
Мекемелер:
- ФГБОУ ВО «Воронежский государственный лесотехнический университет имени Г. Ф. Морозова»
- Шығарылым: № 8 (229) (2023)
- Беттер: 114-123
- Бөлім: Problems and Solutions
- URL: https://journals.eco-vector.com/1992-4178/article/view/632350
- DOI: https://doi.org/10.22184/1992-4178.2023.229.8.114.123
- ID: 632350
Дәйексөз келтіру
Ашық рұқсат
Рұқсат берілді
Аннотация
The technologies of heterogeneous integration and the concept of using chiplets are considered from the point of view of their potential in ensuring the technological sovereignty of the country.
Толық мәтін
Авторлар туралы
A. Achkasov
ФГБОУ ВО «Воронежский государственный лесотехнический университет имени Г. Ф. Морозова»
Хат алмасуға жауапты Автор.
Email: achkasov@list.ru
профессор
Ресей, ВоронежӘдебиет тізімі
- Импортозамещение по-американски: крупнейшие производители полупроводников мира строят фабрики в США: https://habr.com/ru/companies/selectel/articles/684146/
- China’s IC Production Forecast to Double Over Next 5 Years: https://www.eetimes.com/chinas-ic-production-forecast-to-double-over-next-5-years/
- Where All The Semiconductor Investments Are Going: https://semiengineering.com/where-all-the-semiconductor-investments-are-going/
- Total Revenue of Top 10 Foundries: https://trendforce.com/presscenter/news/19700101–11612.html
- Korea’s Hydrogen Fluoride Imports from Japan Recover to 1,000 Tons: http://www.businesskorea.co.kr/news/articleView.html?idxno=116920
- Микроэлектроника: Тревожная ситуация с материалами для микроэлектроники: http://www.mforum.ru/news/article/124029.htm
- Designing For Multiple Die: https://semiengineering.com/designing-for-multiple-die/
- Красников Г. Я. Доклад Председателю Правительства М. В. Мишустину // Стенограмма совещания Правительства РФ по развитию электроники от 30.08.2022
- Introduction to Chiplet Technology: https://anysilicon.com/the-ultimate-guide-to-chiplets/
- Mechanical Challenges Rise With Heterogeneous Integration: https://semiengineering.com/mechanical-challenges-increase-with-chiplet-integration/
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Әрекет
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Fig. 1. China's chip market and chip output in China. Source: IC Insights [2]
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Fig. 2. From basic materials to SnC-type chip (simplified scheme of redesigns)
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Fig. 3. FPC / multichip modules versus chiplet-based architectures (heterogeneous integration). Source: Cadence [7]
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Fig. 4. Roadmap for 3D / 2.5D advanced packaging technologies. Source: Yole Development, 2020
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Fig. 5. Correlation of multiple projects using heterogeneous integration and chippet application
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Fig. 6. Dynamics of patent activity. Source: University of Toronto, 2023
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Fig. 7. Cost factor of SVC when applying different process chiplet rates. Source: Amkor Technology, 2021
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Fig. 8. Comparison of scrap rates for chiplet and monolithic designs. Source: WikiChip
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Fig. 9. Import options for providing processors: a - imported in a case; b - in a SnC crystal; c - in the form of chiplets for assembly in a FPC
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Fig. 10. From basic materials to SVCs on chiplets (simplified redesign scheme)
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