电邮这篇文章 Artificial intelligence: new architectures of ai processors and expanding role in IC design
- 作者: Makushin M.1
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隶属关系:
- НОБ «Военные науки и оборонная промышленность» БРЭ
- 期: 编号 10 (2024)
- 页面: 138-147
- 栏目: Artificial Intelligence
- URL: https://journals.eco-vector.com/1992-4178/article/view/653384
- DOI: https://doi.org/10.22184/1992-4178.2024.241.10.138.147
- ID: 653384
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详细
The article considers the new architectures of AI processors, allowing to balance their speed and efficiency. It is noted that the role of AI in IC design is constantly expanding as CAD tools become more complex.
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作者简介
M. Makushin
НОБ «Военные науки и оборонная промышленность» БРЭ
编辑信件的主要联系方式.
Email: redactor@electronics.ru
ведущий научный редактор
俄罗斯联邦参考
- Sperling Ed. New AI Processors Architectures Balance Speed With Efficiency // Semiconductor Engineering. September 4th, 2024.
- Sperling Ed. 3.5D: The Great Compromise // Semiconductor Engineering. August 21st, 2024.
- Ren Mark. Introduction to AI for Chip Design // Hot Chips 2024 conference. August 25, 2024.
- Berry Chris. IBM Next Generation Processor and AI Accelerator // Hot Chips 2024 conference. August 26, 2024.
- Smith Alan, Vamsi Krishna Alla. InstinctTM MI300X Generative AI Accelerator and Platform Architecture // Hot Chips 2024 conference. August 26, 2024.
- Gihon Arik. Lunar Lake: Powering the Next Generation of AI PCs // Hot Chips 2024 conference. August 26, 2024.
- Gerard Williams. Snapdragon X Elite Qualcomm Oryon CPU: Design & Architecture Overview // Hot Chips 2024 conference. August 26, 2024.
- Paik June. FuriosaAI RNGD: A Tensor Contraction Processor for Sustainable AI Computing // Hot Chips 2024 conference. August 26, 2024.
- Heyman Karen. AI’s Role In Chip Design Widens, Drawing In New Startups // Electronics Engineering. August 29th, 2024.
- Stelios Diamantidis. AI Driven Optimization // Hot Chips 2024 conference. August 25, 2024.
- Hans Bouwmeester. LLM and Chip Design // Hot Chips 2024 conference. August 25, 2024.
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Fig. 1. The size of artificial intelligence (AI) models has grown by more than 70 thousand over the decade. once – by adding new features and parameters. Source: NVIDIA Corporation (Hot Chips 24 Conference)
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Рис. 2. Блок-диаграмма ИС ускорителя для обучения модели ИИ Gaudi 3 корпорации Intel. Источник: корпорация Intel (конференция Hot Chips 2024)
下载 (368KB)
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Fig. 3. Stable architecture of the IC for forming edge logic terminals of Furiosa. Source: Furiosa Company (Hot Chips 24 Conference)
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Fig. 4. As the complexity of design increases, the need for CAD tools equipped with AND increases. Source: Synopsys Corporation (Hot Chips 2024 Conference)
下载 (285KB)
