Single-channel and dual-channel DIP packages for the assembly and sealing of integrated circuit die

S. Shugaepov; Шугаепов Ш.; R. Akhmetgaliev; Ахметгалиев Р.; V. Egoshin; Егошин В.; A. Loskutova; Лоскутова А.

doi:10.22184/1992-4178.2025.251.9.76.78

Single-channel and dual-channel DIP packages for the assembly and sealing of integrated circuit die

Authors: Shugaepov S.¹^,2^,3, Akhmetgaliev R.¹^,2^,3, Egoshin V.¹^,2^,3, Loskutova A.¹
Affiliations:
1. АО «ЗПП»
2. ФГАОУ ВО НИ ТГУ
3. ФГБУ ВО «Марийский государственный университет»
Issue: No 9 (2025)
Pages: 76-78
Section: Design solutions
URL: https://journals.eco-vector.com/1992-4178/article/view/697569
DOI: https://doi.org/10.22184/1992-4178.2025.251.9.76.78
ID: 697569

Cite item

Full Text

Open Access
Restricted Access

Access granted
Restricted Access

Subscription or Fee Access

Abstract
Full Text
About the authors
References
Supplementary files
Statistics

Abstract

The article presents the design and manufacturing technology of two standard metal-ceramic packages (MK 2101.8-8.01 and MK 2101.8-8.02) for the assembly and sealing of integrated circuit dies. These packages provide stable protection of the dies from external factors.

Keywords

assembly, sealing, IC dies, integrated circuits, through-hole technology (THT)

Full Text

About the authors

S. Shugaepov

АО «ЗПП»; ФГАОУ ВО НИ ТГУ; ФГБУ ВО «Марийский государственный университет»

Author for correspondence.
Email: shnshugaepov@zpp12.ru

директор по развитию, аспирант, научный сотрудник

Russian Federation, 424003, Республика Марий Эл, г. Йошкар-Ола, ул. Суворова, 26; 625003, Тюменская область, г. Тюмень, ул. Володарского, д. 6; 424000, Республика Марий Эл, г. Йошкар-Ола, площадь Ленина, д. 1