Design solutions
| 期 | 标题 | 文件 | |
| 编号 3 (234) (2024) | PCB high speed differential pairs for modular connector |
 (Rus) |
|
| Shalomanov V., Bakanin D. | |||
| 编号 3 (234) (2024) | Current trends in packaging leadless metal-polymer packages |
(Rus) |
|
| Abashin E., Alekhin S., Gavrilin A., Dantsev O. | |||
| 编号 2 (233) (2024) | Methodology for calculating the thermal conductivity coefficient of composite materials |
(Rus) |
|
| Tsionenko D., Kozlovsky I. | |||
| 编号 1 (232) (2024) | The use of LETSAR electrical insulating heat-resistant tape in the manufacture of cable |
(Rus) |
|
| Fedintseva A. | |||
| 编号 1 (222) (2023) | Dedicated metal-ceramic packages with integrated and local radiation shields |
(Rus) |
|
| Alontsev A., Grabchikov S. | |||
| 编号 4 (225) (2023) | New metal-ceramic packages from ZPP JSC |
(Rus) |
|
| Shugaepov S., Ermolaev E., Egoshin V., Loskutova A., Sabirova E. | |||
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