电邮这篇文章 Microelectronics: development of the production facilities, sales of equipment and EUV lithography
- 作者: Makushin М.1
-
隶属关系:
- НОБ «Военные науки и оборонная промышленность» БРЭ
- 期: 编号 3 (224) (2023)
- 页面: 116-129
- 栏目: Economy + busyness
- URL: https://journals.eco-vector.com/1992-4178/article/view/629360
- DOI: https://doi.org/10.22184/1992-4178.2023.224.3.116.129
- ID: 629360
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详细
The expansion of the use of ICs and other semiconductor devices, both in their traditional areas and in new areas, leads to an expansion of the production base and an increase in the purchase of equipment for production using advanced processes with minimum design rules.
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作者简介
М. Makushin
НОБ «Военные науки и оборонная промышленность» БРЭ
编辑信件的主要联系方式.
Email: redactor@electronics.ru
научный редактор
参考
- Davis S. Global 200mm Semiconductor Fab Capacity Projected to Surge 20% to Record High by 2025, SEMI Reports // Semiconductor Digest, October 18, 2022.
- Davis S. Global 300mm Semiconductor Fab Capacity Projected To Reach New High in 2025, SEMI Reports // Semiconductor Digest, October 11, 2022.
- Davis S. Global Chip Industry Projected to Invest More Than $500 Billion in New Factories by 2024, SEMI Reports // Semiconductor Digest. December 12, 2022.
- Макушин М. Рынок технологического оборудования, проблемы EUV-литографии и перспективных методов корпусирования // ЭЛЕКТРОНИКА: Наука, Технология, Бизнес. 2022. № 5 (00216). С. 30–41.
- Davis S. Global Total Semiconductor Equipment Sales Forecast to Reach Record High in 2022, SEMI Reports // Semiconductor Digest/ December 13, 2022.
- Макушин М., Мартынов В. Производственные технологии микроэлектроники: проблемы развития. Часть 2 // ЭЛЕКТРОНИКА: Наука, Технология, Бизнес. 2020. № 4 (00195). С. 76–88.
- Shannon Davis. Imec Ramps Up the Development of the High-NA EUV Patterning Ecosystem. Semiconductor Digest. April 26. 2022.
- Derbyshire K. New Challenges Emerge With High-NA EUV // Semiconductor Engineering, March 16th, 2023.
- Davis S. Applied Materials’ New eBeam Metrology System Paves the Way to High-NA EUV Lithography // Semiconductor Digest. March 7, 2023.
- Davis S. Applied Materials’ Pattern-Shaping Technology Reduces the Cost, Complexity and Environmental Impact of Advanced Chip Manufacturing // Semiconductor Digest. March 9, 2023.
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Fig. 1. Number and capacity of 200 mm wafer processing plants (initial stages of wafer processing, excluding epitaxial wafer processing)
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Fig. 2. Dynamics of capacity growth of factories for processing 300 mm wafers (initial stages of wafers processing)
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Fig. 3. Forecast of sales structure of semiconductor equipment
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Fig. 4. Forecast of the sales structure of equipment for wafer processing plants in terms of their specialization
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