电邮这篇文章 Technologies for applying shielding materials to ensure EMC of components in microassemblies
- 作者: Sukhanov D.1
-
隶属关系:
- ООО «Остек-ЭК»
- 期: 编号 3 (2025)
- 页面: 224-228
- 栏目: Micromodules and microassemblies
- URL: https://journals.eco-vector.com/1992-4178/article/view/685772
- DOI: https://doi.org/10.22184/1992-4178.2025.244.3.224.228
- ID: 685772
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详细
The article discusses the technologies for applying shielding materials to components of microassemblies by spraying (including at an angle) using spray heads.
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作者简介
D. Sukhanov
ООО «Остек-ЭК»
编辑信件的主要联系方式.
Email: sukhanov.d@ostec-group.ru
заместитель технического директора
俄罗斯联邦参考
- EMI Shielding Solutions for Semiconductor Packages. – https://www.henkel-adhesives.com/
- Szuch M., Morita A., Wong G., Sakaguchi M., Umeda H. EMI Shielding: Improving Sidewall Coverage with Tilt Spray Coating. IMAPS Device Packaging 2017.
补充文件
附件文件
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JATS XML
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Fig. 1. Schematic diagram of shielding technology development
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Fig. 2. Test results for Tatsuta AE5000A-1 and SF-PC5600 materials (a) and shielding efficiency using EMI 8880S material (b)
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Fig. 3. Coating application options: a – vertical, b – inclined
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Fig. 4. Arrays of components coated with an inclined spray nozzle
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Fig. 5. Cross-section of samples from arrays 1 and 2
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Fig. 6. Results of coating on components installed at different intervals
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Fig. 7. Shielding of cells in a micro-assembly
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