Technologies for applying shielding materials to ensure EMC of components in microassemblies

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详细

The article discusses the technologies for applying shielding materials to components of microassemblies by spraying (including at an angle) using spray heads.

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作者简介

D. Sukhanov

ООО «Остек-ЭК»

编辑信件的主要联系方式.
Email: sukhanov.d@ostec-group.ru

заместитель технического директора

俄罗斯联邦

参考

  1. EMI Shielding Solutions for Semiconductor Packages. – https://www.henkel-adhesives.com/
  2. Szuch M., Morita A., Wong G., Sakaguchi M., Umeda H. EMI Shielding: Improving Sidewall Coverage with Tilt Spray Coating. IMAPS Device Packaging 2017.

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1. JATS XML
2. Fig. 1. Schematic diagram of shielding technology development

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3. Fig. 2. Test results for Tatsuta AE5000A-1 and SF-PC5600 materials (a) and shielding efficiency using EMI 8880S material (b)

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4. Fig. 3. Coating application options: a – vertical, b – inclined

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5. Fig. 4. Arrays of components coated with an inclined spray nozzle

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6. Fig. 5. Cross-section of samples from arrays 1 and 2

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7. Fig. 6. Results of coating on components installed at different intervals

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8. Fig. 7. Shielding of cells in a micro-assembly

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