Email this article Specifics of electron-beam microscale processing of substrates made of various types of ceramics
- Authors: Zhuo Y.1, Maslovsky V.1, Moiseev K.1, Vorobyov I.2, Nazarenko М.3
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Affiliations:
- МГТУ им. Н. Э. Баумана
- ООО «Джиэнаксель»
- РТУ МИРЭА
- Issue: No 3 (224) (2023)
- Pages: 110-115
- Section: Manufacturing technologies
- URL: https://journals.eco-vector.com/1992-4178/article/view/629358
- DOI: https://doi.org/10.22184/1992-4178.2023.224.3.110.115
- ID: 629358
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Abstract
The article considers the capabilities of the method of electron-beam processing of ceramics. The results of experimental studies on the processing of VK94-DN and LTCC KEKO SK‑47 sintered ceramics are presented.
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About the authors
Y. Zhuo
МГТУ им. Н. Э. Баумана
Author for correspondence.
Email: zhuoyy@yandex.ru
аспирант
Russian FederationV. Maslovsky
МГТУ им. Н. Э. Баумана
Email: maslovskyvn.nano@yandex.ru
студент
Russian FederationK. Moiseev
МГТУ им. Н. Э. Баумана
Email: k.moiseev@bmstu.ru
доцент, к. т. н.
Russian FederationI. Vorobyov
ООО «Джиэнаксель»
Email: sales@gnaxel.ru
коммерческий директор
Russian FederationМ. Nazarenko
РТУ МИРЭА
Email: m.v.makarova@list.ru
аспирант
Russian FederationReferences
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Fig. 1. Holes in the VK94-DN substrate, obtained with different numbers of pulses: a – N = 999, d = 2.57 mm; b – N = 600, d = 2.56 mm; c – N = 400, d = 2.61 mm; g – N = 200, d = 2.78 mm
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Fig. 2. Holes in the VK94-DN substrate obtained at different beam currents: a – Iо = 1 mA, d = 2.31 mm; b – Iо = 2 mA, d = 2.62 mm; c – Iо = 3 mA, d = 2.70 mm; d – Iо = 4 mA, d = 2.81 mm; d – Iо = 5 mA, d = 3.26 mm
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Fig. 3. Holes processed at different focus states: a – Iph = 615 mA, d = 2.54 mm; b – Iph = 620 mA, d = 2.50 mm; c – Iph = 625 mA, d = 2.31 mm; d – Iph = 630 mA, d = 2.57 mm; d – Iph = 635 mA, d = 2.67 mm
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Fig. 4. Holes processed at different pulse durations: a – T1 = 5 ms, d = 2.31 mm; b – T1 = 10 ms, d = 3.15 mm; c – T1 = 20 ms, d = 3.53 mm; d – T1 = 30 ms, d = 3.58 mm; d – T1 = 40 ms, d = 3.61 mm; e – T1 = 50 ms, d = 3.71 mm
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Fig. 5. Holes processed at different pause durations: a – T2 = 100 ms, d = 2.31 mm; b – T2 = 60 ms, d = 3.10 mm; c – T2 = 40 ms, d = 3.27 mm; d – T2 = 20 ms, d = 3.10 mm; d – T2 = 10 ms, d = 2.83 mm
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Fig. 6. Steel plate with holes on LTCC sheet (a) and processing diagram (b)
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Fig. 7. Images of holes when drilling with an electron beam with different scanning frequencies: a – 20 Hz; b – 600 Hz; c – 1,200 Hz
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Fig. 8. Processing results at a frequency of 1,200 Hz and various scanning lengths (a.u.): a – 600; b – 700; c – 800; g – 900; d – 999
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Fig. 9. Processing results at a frequency of 50 Hz and various scanning lengths (a.u.): a – 600; b – 700; c – 800; g – 900; d – 999
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Fig. 10. Processing results when scanning at different speeds: a – 1 mm/s; b – 2 mm/s; c – 3 mm/s
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