Specifics of electron-beam microscale processing of substrates made of various types of ceramics

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Resumo

The article considers the capabilities of the method of electron-beam processing of ceramics. The results of experimental studies on the processing of VK94-DN and LTCC KEKO SK‑47 sintered ceramics are presented.

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Sobre autores

Y. Zhuo

МГТУ им. Н. Э. Баумана

Autor responsável pela correspondência
Email: zhuoyy@yandex.ru

аспирант

Rússia

V. Maslovsky

МГТУ им. Н. Э. Баумана

Email: maslovskyvn.nano@yandex.ru

студент

Rússia

K. Moiseev

МГТУ им. Н. Э. Баумана

Email: k.moiseev@bmstu.ru

доцент, к. т. н.

Rússia

I. Vorobyov

ООО «Джиэнаксель»

Email: sales@gnaxel.ru

коммерческий директор

Rússia

М. Nazarenko

РТУ МИРЭА

Email: m.v.makarova@list.ru

аспирант

Rússia

Bibliografia

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2. Fig. 1. Holes in the VK94-DN substrate, obtained with different numbers of pulses: a – N = 999, d = 2.57 mm; b – N = 600, d = 2.56 mm; c – N = 400, d = 2.61 mm; g – N = 200, d = 2.78 mm

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3. Fig. 2. Holes in the VK94-DN substrate obtained at different beam currents: a – Iо = 1 mA, d = 2.31 mm; b – Iо = 2 mA, d = 2.62 mm; c – Iо = 3 mA, d = 2.70 mm; d – Iо = 4 mA, d = 2.81 mm; d – Iо = 5 mA, d = 3.26 mm

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4. Fig. 3. Holes processed at different focus states: a – Iph = 615 mA, d = 2.54 mm; b – Iph = 620 mA, d = 2.50 mm; c – Iph = 625 mA, d = 2.31 mm; d – Iph = 630 mA, d = 2.57 mm; d – Iph = 635 mA, d = 2.67 mm

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5. Fig. 4. Holes processed at different pulse durations: a – T1 = 5 ms, d = 2.31 mm; b – T1 = 10 ms, d = 3.15 mm; c – T1 = 20 ms, d = 3.53 mm; d – T1 = 30 ms, d = 3.58 mm; d – T1 = 40 ms, d = 3.61 mm; e – T1 = 50 ms, d = 3.71 mm

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6. Fig. 5. Holes processed at different pause durations: a – T2 = 100 ms, d = 2.31 mm; b – T2 = 60 ms, d = 3.10 mm; c – T2 = 40 ms, d = 3.27 mm; d – T2 = 20 ms, d = 3.10 mm; d – T2 = 10 ms, d = 2.83 mm

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7. Fig. 6. Steel plate with holes on LTCC sheet (a) and processing diagram (b)

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8. Fig. 7. Images of holes when drilling with an electron beam with different scanning frequencies: a – 20 Hz; b – 600 Hz; c – 1,200 Hz

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9. Fig. 8. Processing results at a frequency of 1,200 Hz and various scanning lengths (a.u.): a – 600; b – 700; c – 800; g – 900; d – 999

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10. Fig. 9. Processing results at a frequency of 50 Hz and various scanning lengths (a.u.): a – 600; b – 700; c – 800; g – 900; d – 999

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11. Fig. 10. Processing results when scanning at different speeds: a – 1 mm/s; b – 2 mm/s; c – 3 mm/s

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Declaração de direitos autorais © Zhuo Y., Maslovsky V., Moiseev K., Vorobyov I., Nazarenko М., 2023