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Contract manufacturing: from a weak link to a strong chain. Part 1
Dashkov S., Filippova S.
Metal-ceramic packages from “ZPP» JSC for RF and microwave devices
Shugaepov S., Ermolaev E., Egoshin V., Gluntsov A.
Contract manufacturing of iсs. The world's leading silicon fabs increase capacities
Makushin M.
Investigation of activation-sensitization systems for PCB small-scale and single-piece production
Barakovsky F., Vantsov S.
Changing a contractor during 1C:ERP adoption: How to minimize risks
Rogozina Y., Kuznetsova E.
New workshop for «old» harnesses: features of production automation for lettered design documentation
Fedintseva A.
Globalization and monopolization of microelectronics in current conditions
Shelepin N.
Use of domestic deep-calcined alumina for the production of metal-ceramic packages
Egoshin V., Shugaepov S., Akhmetgaliev R., Ermolaev E., Mazurenko A., Chernysheva Y.
Minifabs in microelectronics: History and opportunities
Khisamov A., Nazarenko A.
Up-to-date methods of quality control during electronic component mounting
Kremlev K.
Application of algorithmic methods in the process of simulation modeling of technological processes
Lijn E., Khomutskaya O., Vantsov S.
Every atom counts: the use of high-purity gases in the microelectronics industry
Dubyaga S., Kozyrev I.
Contract manufacturing service at ZPP JSC, its risks and benefits
Shakirova E., Shugaepov S., Ermolaev E., Egoshin V.
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