| Issue |
Title |
File |
| No 6 (2025) |
Laser reballing: how modern technologies help improve electronics |
(Rus)
|
|
Shikhov S.
|
| No 6 (2025) |
Precision wafer thinning using glass intermediate carrier |
(Rus)
|
|
Sukhanov D.
|
| No 1 (2025) |
Four ways to decapsulate semiconductor devices |
(Rus)
|
|
Varlamov P.
|
| No 1 (2025) |
Modern methods of removing contaminants from substrates in microelectronics |
(Rus)
|
|
Lelyaev V.
|
| No 9 (2024) |
Selective soldering is the optimal solution for mounting multilayer heat-intensive pcb |
(Rus)
|
|
Vityugov A.
|
| No 7 (2024) |
Spray photoresist application to create a uniform film in cavities |
(Rus)
|
|
Ivanov V.
|
| No 7 (2024) |
Technologies and equipment for temporary and permanent bonding of semiconductor wafers |
(Rus)
|
|
Mandrik I., Novozhilov I.
|
| No 3 (2023) |
Specifics of electron-beam microscale processing of substrates made of various types of ceramics |
(Rus)
|
|
Zhuo Y., Maslovsky V., Moiseev K., Vorobyov I., Nazarenko М.
|
| No 3 (2023) |
Equipment and materials for the manufacture of metal parts at ZPP JSC |
(Rus)
|
|
Polyanin А., Shugaepov S., Ermolaev Е., Egoshin V.
|
| No 2 (2023) |
Stability and reproducibility evaluation of the technological process of metallization through a removable mask |
(Rus)
|
|
Pochtar O., Pochtar A.
|
| No 2 (2023) |
The use of photolithography for the manufacture of metal components at ZPP JSC |
(Rus)
|
|
Pankratova E., Shugaepov S., Ermolaev E., Egoshin V.
|
| No 2 (2023) |
Microbolometers vacuum packaging |
(Rus)
|
|
Vidritsky A., Lanin V.
|
| No 5 (2023) |
Investigation of activation-sensitization systems for PCB small-scale and single-piece production |
(Rus)
|
|
Barakovsky F., Vantsov S.
|
| 1 - 13 of 13 Items |
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