Semiconductors: sales forecasts and development aspects

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Resumo

The article presents estimates and forecasts of the development of the world semiconductor market for the period 2020-2030. General prospects for technological development are considered: further IC scaling, the use of new materials and hybrid methods for connecting IC elements, and the creation of more cost-effective chip pattern generation methods.

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Sobre autores

M. Makushin

НОБ «Военные науки и оборонная промышленность» БРЭ

Autor responsável pela correspondência
Email: redactor@electronics.ru

научный редактор

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Bibliografia

  1. Semiconductor market revenue worldwide from 2020 to 2030, by application // Statista
  2. Semiconductor Market – Global Industry Assessment & Forecast // Vantage Market Research
  3. The global semiconductor market was valued at $555.9 billion in 2021, and is projected to reach $1,033.5 billion by 2031, registering a CAGR of 6.21% from 2022 to 2031. // Allied Market Research. September 2022
  4. Semiconductor Market Size, Share & COVID-19 Impact Analysis by Components and Regional Forecasts, 2022–2029 // Fortune Business Insights. April 2022
  5. Semiconductor Market – Global Industry Analysis, Size, Share, Growth, Trends, Regional Outlook, and Forecast 2022–2030 // Precedence Research.
  6. Chip Sales Rise in 2022, Especially to Auto, Industrial, Consumer Markets // Semiconductor Industry Association. Monday, Mar 27, 2023.
  7. Peters L. Tech Forecast: Fab Processes To Watch Through 2040 // Semiconductor Engineering. March 16th, 2023
  8. Peters L. Big Changes Ahead In Power Delivery, Materials, And Interconnects // Semiconductor Engineering. March 22nd, 2023
  9. Sperling E., Mutschler A. How To Build Resilience Into Chips // Semiconductor Engineering. February 27th, 2023
  10. Sperling E. Mini-Consortia Forming Around Chiplets // Semiconductor Engineering. March 20th, 2023
  11. Bailey B. Taming Corner Explosion In Complex Chips // Semiconductor Engineering. February 23rd, 2023

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2. Fig. 1. Future road map for the development of semiconductor technologies (scaling, device structures, materials and context-sensitive interconnects). Source: Semiconductor Engineering

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3. Fig. 2. Comparison of traditional and promising packaging methods. Source: Fraunhofer IIS EAS/UCIe/Chiplet Summit

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4. Fig. 3. Analysis of various aspects of reliability of IC designs. Source: Cadence

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Declaração de direitos autorais © Makushin M., 2023