Elektronika: Nauka, Tekhnologiya, Biznes
Periodical scientific and technical journal.
Editor-in-Chief
- Alexander S. Sigov, Academician of the Russian Academy of Sciences, President of the Moscow State Institute of Radio Engineering, Electronics and Automation (Technical University).
Publisher
- Associate printing-and-publication centre «Technosphera»
Founder
- Associate printing-and-publication centre «Technosphera»
Indexing
- Russian Science Citation Index (RSCI)
- CrossRef
- Google Scholar
- Ulrich's Periodicals Directory
- WorldCat
Frequency
- 10 issues per year
About
Current Issue
Open Access
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Subscription or Fee Access
No 6 (2025)
Competent opinion
There is expertise to create domestic microelectronics cad in our country
14-21
Exhibitions & conferences
Discussion sessions of ExpoElectronica 2025. Part 3
36-43
Report From A Company
Technologies that open up new opportunities not just in theory but in practice. Visit to additive technology center of dipaul group
44-55
CAD / CAE
Formation of approaches to the development of domestic VLSI CAD
Abstract
The current conditions in the country have made it possible and necessary to create an ecosystem of domestic CAD systems. The article discusses the development trends of modern VLSI design tools, the structure of the global CAD market, as well as the prospects, organizational approaches and main directions of development of domestic CAD systems.
56-65
Development of domestic software tools for physical design and digital VLSI verification
Abstract
Lomonosov Moscow State University, as part of a cooperation headed by ISTC MIET, is developing three components of VLSI CAD: physical synthesis tool, parasitic parameters calculation tool and universal database for storing information on the IC being developed. The article discusses the tasks solved in the course of this work.
66-75
Special types of analysis for modern ICS: challenges of nanometer technologies and application of AI methods
Abstract
The article presents an overview of special types of analysis for modern ICs that take into account such effects as IR drop in power buses, electromigration and signal integrity violation. Methods for implementing special types of analysis in design tools, including using machine learning, are considered.
76-83
Frequency analysis of transmission lines in SimPCB Lite CAD
Abstract
The article discusses the mathematical and physical principles of calculating transmission line parameters depending on frequency, implemented in the SimPCB Lite CAD system. A comparison of the calculation results obtained using SimPCB Lite and Ansys program is given.
84-87
KOMPAS-3D from ASCON is a professional tool for designing technological equipment for metal-ceramic production
Abstract
KOMPAS-3D is a full-featured platform for engineers of the domestic mechanical engineering and electronics industries. When designing technological equipment for the production of metal-ceramic packages this system combines 3D simulation tools with the integration of Russian standards.
88-91
Industrial Electronics and Embedded Systems
GKV inertial navigation modules: anti-spoofing and enhanced navigation capabilities
Abstract
Spoofing of global navigation systems can lead to location data corruption, which is especially dangerous for air and sea transport. The article discusses the solutions from “Laboratoriya Microbriborov” for autonomous inertial navigation that can resist spoofing.
92-97
Power Electronics
Tethered drones and the role of smartpower high-voltage DC/DC converters in ensuring stable power supply
Abstract
The article discusses the specifics of using tethered drones that is aircraft that receive power from a ground source via a cable. Particular attention is paid to the role of SmartPower high-voltage DC/DC converters in ensuring efficient power supply for onboard systems.
98-102
FOR ENGINEERS
Hybrid control system for memristive arrays: development of a high-level scheme and implementation prospects
Abstract
The article proposes a memristive array control architecture that allows working with passive crossbar structures, which significantly increases the layout density and reduces the technological complexity of production. The main functional blocks of the system are described.
106-112
Micro and nanostructures
High-frequency capacitors manufactured using MEMS Technology
Abstract
The article provides an overview of the main technologies used to manufacture microelectromechanical systems (MEMS). It examines the design features of MEMS capacitors and their operating principles, and provides examples of devices based on them.
116-125
Manufacturing technologies
Precision wafer thinning using glass intermediate carrier
Abstract
The article considers methods of precision thinning of semiconductor wafers and substantiates the expediency of using a glass substrate. The influence of elastic characteristics and thermal expansion coefficients on the deformation of a bilayer structure is analyzed, and the stresses arising during wafer dismantling are investigated to check the reliability of the glass carrier.
126-133
Laser reballing: how modern technologies help improve electronics
Abstract
Laser reballing is an innovative technology for repairing ICs in BGA packages that uses a laser for precise positioning and reliable soldering of solder balls to the BGA component package. The article describes the technological process and discusses the advantages of the method.
134-137
Manufacturing equipment and process materials
Cleaning printed circuit boards from flux
Abstract
The article describes the functional capabilities of the USOTP-1 vacuum jet cleaning machine developed by NPP PROTON. The innovative Russian “jets in a vacuum” technology provides highly efficient cleaning and drying of products, combining jet processing with cyclic vacuuming.
138-143
Reliability and validation
144-149
Photon emission is an innovative method for analyzing defects in microelectronics
Abstract
The analytical complex “Photon”, developed jointly by “Optoelectronic systems” JSC and NTC “Belmicrosystems”, solves the problem of identifying hidden defects of integrated circuits, such as structural defects of the crystal lattice, local current leaks and overheating of power elements.
150-152