Elektronika: Nauka, Tekhnologiya, Biznes
ISSN 1992-4178 (Print)
ISSN 1992-4186 (Online)
Menu
Archives
Home
About the Journal
Editorial Team
Editorial Policies
Author Guidelines
About the Journal
Issues
Search
Current
Retracted articles
Archives
Contact
Subscriptions
All Journals
User
Username
Password
Remember me
Forgot password?
Register
Notifications
View
Subscribe
Subscription
Login to verify subscription
Search
Search
Search Scope
All
Authors
Title
Abstract
Index terms
Full Text
Browse
By Issue
By Author
By Title
By Sections
Other Journals
Categories
Keywords
CAD
RISC-V architecture
artificial intelligence
dynamic range
electronic components
frequency range
import substitution
information and measurement system
insertion loss
interface
metal-ceramic package
power
printed circuit board
printed circuit boards
production
reliability
robotics
roundness tester
spectrum analyzer
switch
testing
×
User
Username
Password
Remember me
Forgot password?
Register
Notifications
View
Subscribe
Subscription
Login to verify subscription
Search
Search
Search Scope
All
Authors
Title
Abstract
Index terms
Full Text
Browse
By Issue
By Author
By Title
By Sections
Other Journals
Categories
Keywords
CAD
RISC-V architecture
artificial intelligence
dynamic range
electronic components
frequency range
import substitution
information and measurement system
insertion loss
interface
metal-ceramic package
power
printed circuit board
printed circuit boards
production
reliability
robotics
roundness tester
spectrum analyzer
switch
testing
Home
>
Search
>
Author Details
Author Details
Makushin, M.
Issue
Section
Title
File
No 1 (2023)
Economy + busyness
Contract manufacturing of iсs. The world's leading silicon fabs increase capacities
No 2 (2023)
Economy + busyness
CHIPS Act and some aspects of improving the US R&D ecosystem
No 4 (2023)
Economy + busyness
Semiconductors: sales forecasts and development aspects
No 8 (2023)
Economy + busyness
Microelectronics: CHIPS Act and expansion of the US manufacturing base
No 6 (2023)
Economy + busyness
Difficulties in implementing the chips act in the US
No 5 (2024)
Information and telecommunication systems
6G network development aspectsю
No 6 (2024)
Information and telecommunication systems
6G network development aspects. Part 2
No 8 (2024)
Micro and nanostructures
EUV lithography: what is expected in 2025?
No 10 (2024)
Artificial Intelligence
Artificial intelligence: new architectures of ai processors and expanding role in IC design
No 2 (2025)
Manufacturing equipment and process materials
Semiconductor manufacturing equipment: steady growth in purchases until 2027
No 5 (2025)
Information and telecommunication systems
6G technology development aspects
TOP