№ 7 (2025)

The development of artificial intelligence is impossible without the creation of a specialized element base and CAD tools for its design. At the same time, the introduction of AI systems affects the development of new CAD systems and their functioning.

The article substantiates the concept of a trusted electronic component base (ECB) for regulated critical information infrastructure (CII) markets as a possible new quality and safety category, in addition to the existing categories of ECB for special-purpose and general-purpose applications. Their features and distinctions are analyzed.

The article describes the main technical characteristics of a new generation of integrated circuits developed by ICC Milandr JSC for electricity meters: the MDR1206FI microcontroller, the MDR5103FI ADC IC, the MDR3401FI RS-485 transceiver IC, and the MDR2306FI flash memory IC.

Geehy Semiconductor is a fabless company specializing in the development of microcontrollers, systems on chip, analog and mixed-signal integrated circuits. The article reviews the key series of Geehy microcontrollers for civil and industrial applications.

The article examines architectural features, element base and practical aspects of implementing software-defined radio (SDR) technology in radio equipment. A line of Cruetech modern software-defined radio modules is presented.

The article presents intelligent radio sensors for a measuring and control system for rational soil irrigation. The radio sensors feature multi-channel capability, dual power supply from photoelectric converters and a Li-ion battery, support energy saving mode and include protection against electromagnetic interference.

The article considers based on a large number of foreign and domestic publications, the physical processes of passive intermodulation in radio frequency connectors and cables used in wireless communication systems. Methods for reducing the level of passive intermodulation are given.

This article describes HD TSV and hybrid bonding technologies that enable the integration of various components for sensors and imaging systems. Optimization of the thinning process and reduction of the TSV aspect ratio eliminated electrical leakage and significantly improved TSV performance.

The article reviews the physical foundations and practice of application of DUV-microscopy. The development of laser technologies and the emergence of new sensors, modern optical materials opens the way to its widespread implementation in microelectronics, biomedicine and materials science.

The article provides an overview of solutions for automatic optical inspection of printed circuit boards during production from ALeader.

During wave soldering, defects inevitably appear, the number of which directly depends on the speed of the process. The article discusses the features and advantages of ALD-ASR600 automatic wave soldering repair system from ALeader.

The article examines projects implemented by A-CONTRACT engineers over more than 20 years of the enterprise’s work on the Russian contract manufacturing market, and innovative solutions for non-standard problems that arise in the process of manufacturing high-tech electronic units and modules.