Bench-top automatic machine for gold wire mounting by ball-wedge method
- Authors: Petukhov I.1, Letunovich E.1
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Affiliations:
- ОАО «Планар-СО»
- Issue: No 2 (223) (2023)
- Pages: 54-59
- Section: Manufacturing equipment and process materials
- URL: https://journals.eco-vector.com/1992-4178/article/view/629194
- ID: 629194
Cite item
Abstract
The article describes the bench-top automatic machine for thermosonic micro welding gold wire leads with a diameter of 17.5 to 50 μm featured an automatic system for the alignment of working tool with multi-level pads and a precision three-axis coordinate system based on servo drives. The machine provides automatic leads mounting according to the coordinates of the interconnection points previously stored in the memory.
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About the authors
I. Petukhov
ОАО «Планар-СО»
Author for correspondence.
Email: petuchov@kbtem.by
к. т. н., начальник научно-технического центра
BelarusE. Letunovich
ОАО «Планар-СО»
Email: petuchov@kbtem.by
начальник лаборатории
BelarusReferences
- Достанко А. П. [др.]. Технологические процессы и системы в микроэлектронике: плазменные, электронно-ионно-лучевые, ультразвуковые. / Минск: Бестпринт, 2009. 202 с.
- Harmann G. G. Wire bonding in microelectronics. Third Edition. / N.Y.: McGraw Hill, 2010. 427 p.
- Abe H., Kang D. C., Yamamoto T., Yagihashi T., Endo Y., Saito H., Horie T., Tamate H., Ejiri Y., Watanabe N. and Iwasaki T. Cu wire and Pd-Cu wire package reliability and molding compounds, 2012. IEEE 62nd Electronic Components and Technology Conference, IEEE, San Diego, CA, pp. 1117–1123.
- Appelt B. K., Tseng A., Chen C.-H. and Lai Y.-S. Fine pitch copper wire bonding in high volume production, Microelectronics Reliability, Vol. 51. No. 1, 2011, pp. 13–20.
- https://www.hesse-mechatronics.com/en/
- https://www.kns.com/Products/Equipment/Ball-Bonder
- https://www.fkdelvotec.com/en/medien/downloads/
- https://www.asmpacific.com/en/products?equipment=4
- Петухов И. Б. Стабилизация сварочного усилия в процессе ультразвукового монтажа проволочных и ленточных выводов // Технологии и конструирование в электронной аппаратуре. 2021. № 1–2. С. 49–53.