Email this article Chiplets and heterogeneous integration as a basic technology stack capable of ensuring the sovereignty of domestic electronics in a new technological order
- Authors: Achkasov A.1
-
Affiliations:
- ФГБОУ ВО «Воронежский государственный лесотехнический университет имени Г. Ф. Морозова»
- Issue: No 8 (229) (2023)
- Pages: 114-123
- Section: Problems and Solutions
- URL: https://journals.eco-vector.com/1992-4178/article/view/632350
- DOI: https://doi.org/10.22184/1992-4178.2023.229.8.114.123
- ID: 632350
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Abstract
The technologies of heterogeneous integration and the concept of using chiplets are considered from the point of view of their potential in ensuring the technological sovereignty of the country.
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About the authors
A. Achkasov
ФГБОУ ВО «Воронежский государственный лесотехнический университет имени Г. Ф. Морозова»
Author for correspondence.
Email: achkasov@list.ru
профессор
Russian Federation, ВоронежReferences
- Импортозамещение по-американски: крупнейшие производители полупроводников мира строят фабрики в США: https://habr.com/ru/companies/selectel/articles/684146/
- China’s IC Production Forecast to Double Over Next 5 Years: https://www.eetimes.com/chinas-ic-production-forecast-to-double-over-next-5-years/
- Where All The Semiconductor Investments Are Going: https://semiengineering.com/where-all-the-semiconductor-investments-are-going/
- Total Revenue of Top 10 Foundries: https://trendforce.com/presscenter/news/19700101–11612.html
- Korea’s Hydrogen Fluoride Imports from Japan Recover to 1,000 Tons: http://www.businesskorea.co.kr/news/articleView.html?idxno=116920
- Микроэлектроника: Тревожная ситуация с материалами для микроэлектроники: http://www.mforum.ru/news/article/124029.htm
- Designing For Multiple Die: https://semiengineering.com/designing-for-multiple-die/
- Красников Г. Я. Доклад Председателю Правительства М. В. Мишустину // Стенограмма совещания Правительства РФ по развитию электроники от 30.08.2022
- Introduction to Chiplet Technology: https://anysilicon.com/the-ultimate-guide-to-chiplets/
- Mechanical Challenges Rise With Heterogeneous Integration: https://semiengineering.com/mechanical-challenges-increase-with-chiplet-integration/
Supplementary files
Supplementary Files
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JATS XML
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Fig. 1. China's chip market and chip output in China. Source: IC Insights [2]
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Fig. 2. From basic materials to SnC-type chip (simplified scheme of redesigns)
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Fig. 3. FPC / multichip modules versus chiplet-based architectures (heterogeneous integration). Source: Cadence [7]
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Fig. 4. Roadmap for 3D / 2.5D advanced packaging technologies. Source: Yole Development, 2020
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Fig. 5. Correlation of multiple projects using heterogeneous integration and chippet application
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Fig. 6. Dynamics of patent activity. Source: University of Toronto, 2023
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Fig. 7. Cost factor of SVC when applying different process chiplet rates. Source: Amkor Technology, 2021
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Fig. 8. Comparison of scrap rates for chiplet and monolithic designs. Source: WikiChip
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Fig. 9. Import options for providing processors: a - imported in a case; b - in a SnC crystal; c - in the form of chiplets for assembly in a FPC
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Fig. 10. From basic materials to SVCs on chiplets (simplified redesign scheme)
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