Chiplets and heterogeneous integration as a basic technology stack capable of ensuring the sovereignty of domestic electronics in a new technological order

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The technologies of heterogeneous integration and the concept of using chiplets are considered from the point of view of their potential in ensuring the technological sovereignty of the country.

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作者简介

A. Achkasov

ФГБОУ ВО «Воронежский государственный лесотехнический университет имени Г. Ф. Морозова»

编辑信件的主要联系方式.
Email: achkasov@list.ru

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俄罗斯联邦, Воронеж

参考

  1. Импортозамещение по-американски: крупнейшие производители полупроводников мира строят фабрики в США: https://habr.com/ru/companies/selectel/articles/684146/
  2. China’s IC Production Forecast to Double Over Next 5 Years: https://www.eetimes.com/chinas-ic-production-forecast-to-double-over-next-5-years/
  3. Where All The Semiconductor Investments Are Going: https://semiengineering.com/where-all-the-semiconductor-investments-are-going/
  4. Total Revenue of Top 10 Foundries: https://trendforce.com/presscenter/news/19700101–11612.html
  5. Korea’s Hydrogen Fluoride Imports from Japan Recover to 1,000 Tons: http://www.businesskorea.co.kr/news/articleView.html?idxno=116920
  6. Микроэлектроника: Тревожная ситуация с материалами для микроэлектроники: http://www.mforum.ru/news/article/124029.htm
  7. Designing For Multiple Die: https://semiengineering.com/designing-for-multiple-die/
  8. Красников Г. Я. Доклад Председателю Правительства М. В. Мишустину // Стенограмма совещания Правительства РФ по развитию электроники от 30.08.2022
  9. Introduction to Chiplet Technology: https://anysilicon.com/the-ultimate-guide-to-chiplets/
  10. Mechanical Challenges Rise With Heterogeneous Integration: https://semiengineering.com/mechanical-challenges-increase-with-chiplet-integration/

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1. JATS XML
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2. Fig. 1. China's chip market and chip output in China. Source: IC Insights [2]

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3. Fig. 2. From basic materials to SnC-type chip (simplified scheme of redesigns)

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4. Fig. 3. FPC / multichip modules versus chiplet-based architectures (heterogeneous integration). Source: Cadence [7]

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5. Fig. 4. Roadmap for 3D / 2.5D advanced packaging technologies. Source: Yole Development, 2020

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6. Fig. 5. Correlation of multiple projects using heterogeneous integration and chippet application

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7. Fig. 6. Dynamics of patent activity. Source: University of Toronto, 2023

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8. Fig. 7. Cost factor of SVC when applying different process chiplet rates. Source: Amkor Technology, 2021

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9. Fig. 8. Comparison of scrap rates for chiplet and monolithic designs. Source: WikiChip

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10. Fig. 9. Import options for providing processors: a - imported in a case; b - in a SnC crystal; c - in the form of chiplets for assembly in a FPC

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11. Fig. 10. From basic materials to SVCs on chiplets (simplified redesign scheme)

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版权所有 © Achkasov A., 2023