Email this article Equipment and methods for semiconductor die mounting
- Authors: Mandrik I.1, Novozhilov I.1
-
Affiliations:
- ГК «Диполь»
- Issue: No 1 (2025)
- Pages: 76-83
- Section: Manufacturing equipment and process materials
- URL: https://journals.eco-vector.com/1992-4178/article/view/683109
- DOI: https://doi.org/10.22184/1992-4178.2025.242.1.76.83
- ID: 683109
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Abstract
The article discusses equipment for high-precision mounting of semiconductor dies and the requirements imposed on it, and also provides information on various methods of die mounting.
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About the authors
I. Mandrik
ГК «Диполь»
Author for correspondence.
Email: MandrikIV@dipaul.ru
к.т.н., руководитель проектов
Russian FederationI. Novozhilov
ГК «Диполь»
Email: NovozhilovIA@dipaul.ru
руководитель направления «Микроэлектроника»
Russian FederationSupplementary files
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1.
JATS XML
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Fig. 1. T18 high-precision crystal assembly machine
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Fig. 2. T18 programmable glue dispenser
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Fig. 3. S17 crystal sorting machine
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Fig. 4. Crystal sorting process
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Fig. 5. M18 multi-crystal assembly machine
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Fig. 6. M-10S desktop assembly machine for R&D
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