Special types of analysis for modern ICS: challenges of nanometer technologies and application of AI methods

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Abstract

The article presents an overview of special types of analysis for modern ICs that take into account such effects as IR drop in power buses, electromigration and signal integrity violation. Methods for implementing special types of analysis in design tools, including using machine learning, are considered.

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About the authors

А. Stempkovsky

ООО «Альфачип»

Author for correspondence.
Email: stal@alphachip.ru

генеральный директор, д.т.н.

Russian Federation

E. Kozhevnikov

ООО «Альфачип»

Email: kozhevnikov@alphachip.ru

главный специалист, к.ф.-м.н.

Russian Federation

Е. Demidov

ООО «Альфачип»

Email: yevgeniy_demidov_1999@mail.ru

инженер

Russian Federation

R. Soloviev

ООО «Альфачип»

Email: roman.solovyev.zf@gmail.com

заместитель генерального директора по инновационной деятельности, д.т.н.

Russian Federation

D. Telpukhov

ООО «Альфачип»

Email: telpukhov@alphachip.ru

заместитель генерального директора по научной работе, д.т.н.

Russian Federation

L. Pereverzev

ООО «Альфачип»

Email: leonidp@alphachip.ru

технический директор

Russian Federation

V. Kartashev

ООО «Альфачип»

Email: kartvlad2702@yandex.ru

инженер

Russian Federation

V. Dozhdev

Минпромторг РФ

Email: dozhdevvs@minprom.gov.ru

директор департамента цифровых технологий

Russian Federation

I. Nazarov

ООО «Альфачип»

Email: inazov2014@mail.ru

инженер

Russian Federation

A. Tretyakov

ООО «Альфачип»

Email: trealexnix@yandex.ru

инженер

Russian Federation

References

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  14. Zhigulin A., Rogozhinskiy M., Solovyev R., Telpukhov D., Levchenko N., Stempkovskiy A., Pereverzev L. Applying Machine Learning Methods to Signal Integrity Analysis. In 2024 Ivannikov Ispras Open Conference (ISPRAS) 2024. December (PP. 1–5). IEEE.
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Supplementary files

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2. Fig. 1. An example of an equivalent circuit model for performing static IR-drop analysis

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3. Fig. 2. Matrices for training an ML model to predict the results of static IR-drop analysis

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4. Fig. 3. Manifestations of electromigration in current-carrying elements of integrated circuits

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5. Fig. 4. The occurrence of interference in a pair of “aggressor” and “victim” chains

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Copyright (c) 2025 Stempkovsky А., Kozhevnikov E., Demidov Е., Soloviev R., Telpukhov D., Pereverzev L., Kartashev V., Dozhdev V., Nazarov I., Tretyakov A.