№ 6 (2025)

The current conditions in the country have made it possible and necessary to create an ecosystem of domestic CAD systems. The article discusses the development trends of modern VLSI design tools, the structure of the global CAD market, as well as the prospects, organizational approaches and main directions of development of domestic CAD systems.

The article presents an overview of special types of analysis for modern ICs that take into account such effects as IR drop in power buses, electromigration and signal integrity violation. Methods for implementing special types of analysis in design tools, including using machine learning, are considered.

KOMPAS-3D is a full-featured platform for engineers of the domestic mechanical engineering and electronics industries. When designing technological equipment for the production of metal-ceramic packages this system combines 3D simulation tools with the integration of Russian standards.

Spoofing of global navigation systems can lead to location data corruption, which is especially dangerous for air and sea transport. The article discusses the solutions from “Laboratoriya Microbriborov” for autonomous inertial navigation that can resist spoofing.

The article discusses the specifics of using tethered drones that is aircraft that receive power from a ground source via a cable. Particular attention is paid to the role of SmartPower high-voltage DC/DC converters in ensuring efficient power supply for onboard systems.

The article proposes a memristive array control architecture that allows working with passive crossbar structures, which significantly increases the layout density and reduces the technological complexity of production. The main functional blocks of the system are described.

The article provides an overview of the main technologies used to manufacture microelectromechanical systems (MEMS). It examines the design features of MEMS capacitors and their operating principles, and provides examples of devices based on them.

The article considers methods of precision thinning of semiconductor wafers and substantiates the expediency of using a glass substrate. The influence of elastic characteristics and thermal expansion coefficients on the deformation of a bilayer structure is analyzed, and the stresses arising during wafer dismantling are investigated to check the reliability of the glass carrier.

The article describes the functional capabilities of the USOTP-1 vacuum jet cleaning machine developed by NPP PROTON. The innovative Russian “jets in a vacuum” technology provides highly efficient cleaning and drying of products, combining jet processing with cyclic vacuuming.

The article presents current information about stands for burn-in testing of semiconductor electronics products of FTT-17 series, developed by the company “Sovtest ATE”.