Enviar artigo por via de e-mail Trends in packaging and assembly of discrete power components based on MOSFETs
- Autores: Ivanov V.1, Sukhanov D.1
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Afiliações:
- ООО «Остек-ЭК»
- Edição: Nº 10 (2024)
- Páginas: 154-162
- Seção: Design solutions
- URL: https://journals.eco-vector.com/1992-4178/article/view/653403
- DOI: https://doi.org/10.22184/1992-4178.2024.241.10.154.162
- ID: 653403
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Resumo
The article considers various types of power semiconductor devices. Information is provided on different types of packages for power components based on MOSFETs offered by a number of manufacturers.
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Sobre autores
V. Ivanov
ООО «Остек-ЭК»
Autor responsável pela correspondência
Email: ivanov.v@ostec-group.ru
начальник группы
RússiaD. Sukhanov
ООО «Остек-ЭК»
Email: sukhanov.d@ostec-group.ru
заместитель технического директора
RússiaArquivos suplementares
Arquivos suplementares
Ação
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JATS XML
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Fig. 1. Types of power elements (a) and MOSFET structure (b)
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Fig. 2. plug-in enclosures: a-DIP; B – to; C-PGA
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Fig. 3. surface mounting enclosures: a-D-PAK; B-SOT; C-SOP; d-QFP; e-PLCC
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Fig. 4. The main case design for: a-TO-247; b-TO-220; v-TO-220F; g-D-PAK; d-D2PAK
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5. Dimensions (in mm) of the TO 252/DPAK (a) and TO-263/D2PAK (b) enclosures
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6. Types of SOT enclosures: a – SOT23; b – SOT323; c – SOT89; d – SOT23-6; e – SOT363/SOT26
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Fig. 7. SOP enclosures for MOSFETs: a – TSOP6; b – TTSOP-8
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8. The first version of the WPAK-D1 housing (a) and the second WPAK-D2 with reduced inductance (b)
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Fig. 9. LFPAK (a) and LFPAK-i (b) buildings of Renesas company
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Figure 10. Intel's DrMOS (a) versus the standard build option (b)
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Pain. 11. Vishay PowerPak 1212-8 (a) and PowerPak SO-8 (b) enclosures
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Pain. 12. Polar-PAK Corporation Vishay Company
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Pain. 13. Onsemi's DFN5 (SO-8FL) (a) and WDFN8 (b) buildings
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Fig. 14. LFPAK (a) and QFPAK (b) NXP enclosures (dimensions in mm)
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Fig. 15. Fairchild Semiconductor Power56 housing (dimensions in mm)
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Fig. 16. The design of the International Rectifier DirectFET enclosure
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Fig. 17. Wire welding of interconnects in TO, D-PAK, SET (a) and SOP (b) type housings
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Fig. 18. Assembly schemes based on the technologies of IR, Vishay (a) and Fairchild (b) companies
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