Мақаланы E-mail арқылы жіберу Precision wafer thinning using glass intermediate carrier
- Авторлар: Sukhanov D.1
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Мекемелер:
- ООО «Остек-ЭК»
- Шығарылым: № 6 (2025)
- Беттер: 125-132
- Бөлім: Manufacturing technologies
- URL: https://journals.eco-vector.com/1992-4178/article/view/688723
- DOI: https://doi.org/10.22184/1992-4178.2025.247.6.126.132
- ID: 688723
Дәйексөз келтіру
Ашық рұқсат
Рұқсат берілді
Аннотация
The article considers methods of precision thinning of semiconductor wafers and substantiates the expediency of using a glass substrate. The influence of elastic characteristics and thermal expansion coefficients on the deformation of a bilayer structure is analyzed, and the stresses arising during wafer dismantling are investigated to check the reliability of the glass carrier.
Негізгі сөздер
Толық мәтін
Авторлар туралы
D. Sukhanov
ООО «Остек-ЭК»
Хат алмасуға жауапты Автор.
Email: micro@ostec-group.ru
заместитель технического директора
РесейӘдебиет тізімі
- Brueckner J., Gaab A., Lin S., Chang E., Ono T., Singh V., Zhang J., Tussing S., Spiess W. Enabling wafer thinning using a glass carrier // Chip Scale Review. March – April, 2021
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Әрекет
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JATS XML
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Fig. 1. Graphs of the dependences of the deformation of a two-layer structure on various parameters: (a) – on the CTE mismatch: Eg = 70 GPa, tg = 1.1 mm; (b) – on the Young’s modulus of the carrier: tg = 1.1 mm, ΔCTE = 1.0 μm/°C; (c) – on the carrier thickness: Eg = 70 GPa; ΔCTE = 1.0 μm/°C
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Fig. 2. Glass plates covering the CTE range of 3–13 µm/°C
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Fig. 3. General technological process of thinning and mechanical separation
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Fig. 4. Schematic representation of the processes of edge trimming, mounting on a carrier and thinning
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Fig. 5. The result of the process of mounting the plate on a glass carrier
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Fig. 6. Results of the dismantling process from a glass carrier [1]
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Fig. 7. Schematic representation of glass bending during the debonding process.
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Fig. 8. Graphs of the dependence of bending stress on the radii of curvature of glass plates for thicknesses of 0.5 and 0.7 mm
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