Email this article Precision wafer thinning using glass intermediate carrier
- Authors: Sukhanov D.1
-
Affiliations:
- ООО «Остек-ЭК»
- Issue: No 6 (2025)
- Pages: 126-133
- Section: Manufacturing technologies
- URL: https://journals.eco-vector.com/1992-4178/article/view/688723
- DOI: https://doi.org/10.22184/1992-4178.2025.247.6.126.132
- ID: 688723
Cite item
Open Access
Access granted
Abstract
The article considers methods of precision thinning of semiconductor wafers and substantiates the expediency of using a glass substrate. The influence of elastic characteristics and thermal expansion coefficients on the deformation of a bilayer structure is analyzed, and the stresses arising during wafer dismantling are investigated to check the reliability of the glass carrier.
Full Text
About the authors
D. Sukhanov
ООО «Остек-ЭК»
Author for correspondence.
Email: micro@ostec-group.ru
заместитель технического директора
Russian FederationReferences
- Brueckner J., Gaab A., Lin S., Chang E., Ono T., Singh V., Zhang J., Tussing S., Spiess W. Enabling wafer thinning using a glass carrier // Chip Scale Review. March – April, 2021
Supplementary files
Supplementary Files
Action
1.
JATS XML
2.
Fig. 1. Graphs of the dependences of the deformation of a two-layer structure on various parameters: (a) – on the CTE mismatch: Eg = 70 GPa, tg = 1.1 mm; (b) – on the Young’s modulus of the carrier: tg = 1.1 mm, ΔCTE = 1.0 μm/°C; (c) – on the carrier thickness: Eg = 70 GPa; ΔCTE = 1.0 μm/°C
Download (179KB)
3.
Fig. 2. Glass plates covering the CTE range of 3–13 µm/°C
Download (111KB)
4.
Fig. 3. General technological process of thinning and mechanical separation
Download (206KB)
5.
Fig. 4. Schematic representation of the processes of edge trimming, mounting on a carrier and thinning
Download (110KB)
6.
Fig. 5. The result of the process of mounting the plate on a glass carrier
Download (67KB)
7.
Fig. 6. Results of the dismantling process from a glass carrier [1]
Download (187KB)
8.
Fig. 7. Schematic representation of glass bending during the debonding process.
Download (70KB)
9.
Fig. 8. Graphs of the dependence of bending stress on the radii of curvature of glass plates for thicknesses of 0.5 and 0.7 mm
Download (144KB)
