电邮这篇文章 Semiconductors: sales forecasts and development aspects
- 作者: Makushin M.1
-
隶属关系:
- НОБ «Военные науки и оборонная промышленность» БРЭ
- 期: 编号 4 (2023)
- 页面: 58-68
- 栏目: Economy + busyness
- URL: https://journals.eco-vector.com/1992-4178/article/view/631461
- DOI: https://doi.org/10.22184/1992-4178.2023.225.4.58.68
- ID: 631461
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详细
The article presents estimates and forecasts of the development of the world semiconductor market for the period 2020-2030. General prospects for technological development are considered: further IC scaling, the use of new materials and hybrid methods for connecting IC elements, and the creation of more cost-effective chip pattern generation methods.
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作者简介
M. Makushin
НОБ «Военные науки и оборонная промышленность» БРЭ
编辑信件的主要联系方式.
Email: redactor@electronics.ru
научный редактор
俄罗斯联邦参考
- Semiconductor market revenue worldwide from 2020 to 2030, by application // Statista
- Semiconductor Market – Global Industry Assessment & Forecast // Vantage Market Research
- The global semiconductor market was valued at $555.9 billion in 2021, and is projected to reach $1,033.5 billion by 2031, registering a CAGR of 6.21% from 2022 to 2031. // Allied Market Research. September 2022
- Semiconductor Market Size, Share & COVID-19 Impact Analysis by Components and Regional Forecasts, 2022–2029 // Fortune Business Insights. April 2022
- Semiconductor Market – Global Industry Analysis, Size, Share, Growth, Trends, Regional Outlook, and Forecast 2022–2030 // Precedence Research.
- Chip Sales Rise in 2022, Especially to Auto, Industrial, Consumer Markets // Semiconductor Industry Association. Monday, Mar 27, 2023.
- Peters L. Tech Forecast: Fab Processes To Watch Through 2040 // Semiconductor Engineering. March 16th, 2023
- Peters L. Big Changes Ahead In Power Delivery, Materials, And Interconnects // Semiconductor Engineering. March 22nd, 2023
- Sperling E., Mutschler A. How To Build Resilience Into Chips // Semiconductor Engineering. February 27th, 2023
- Sperling E. Mini-Consortia Forming Around Chiplets // Semiconductor Engineering. March 20th, 2023
- Bailey B. Taming Corner Explosion In Complex Chips // Semiconductor Engineering. February 23rd, 2023
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Fig. 1. Future road map for the development of semiconductor technologies (scaling, device structures, materials and context-sensitive interconnects). Source: Semiconductor Engineering
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Fig. 2. Comparison of traditional and promising packaging methods. Source: Fraunhofer IIS EAS/UCIe/Chiplet Summit
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Fig. 3. Analysis of various aspects of reliability of IC designs. Source: Cadence
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