Influence of design parameters on plane strain of printed circuit boards

封面

全文:

开放存取 开放存取
受限制的访问 ##reader.subscriptionAccessGranted##
受限制的访问 订阅或者付费存取

详细

The article describes the development of mathematical model of plane strain of printed circuit board layers and experimental verification of its accuracy. The obtained experimental results qualitatively completely coincide with the calculation results; the quantitative discrepancy does not exceed 20%, which can be considered satisfactory at this step of clarifying the model coefficients taking into account random factors.

全文:

受限制的访问

作者简介

S. Vantsov

МАИ (НИУ)

编辑信件的主要联系方式.
Email: van2851@mail.ru

к. т. н., доцент

俄罗斯联邦

O. Khomutskaya

МАИ (НИУ)

Email: khomutskayaov@gmail.com

к. т. н., доцент

俄罗斯联邦

E. Liin

МАИ (НИУ)

Email: elijn@bk.ru

аспирант каф. 307

俄罗斯联邦

参考

  1. Никитин С., Поздняков К., Хомутская О. Оценка деформации печатных плат // ЭЛЕКТРОНИКА: Наука, Технология, Бизнес. 2019. № 5. С. 144–150.
  2. Куликов Н., Хомутская О., Ванцов С. Цифровой метод автоматизированной оценки деформации печатной платы // ЭЛЕКТРОНИКА: Наука, Технология, Бизнес. 2018. № 2. С. 186–191.

补充文件

附件文件
动作
1. JATS XML
2. Fig. 1. Phase transitions during heating of thermosetting polymers. Tg - glass transition temperature; Tf - decomposition temperature; ΔL/L - relative change in linear dimensions

下载 (35KB)
3. Fig. 2. Display of the hole offset direction on the printed circuit board. - start position of the hole; - end position of the hole

下载 (145KB)
4. Fig. 3. Approximate view of PCB fragments: a - investigated sample; b - real board

下载 (70KB)
5. Fig. 4. Hole areas

下载 (42KB)
6. Fig. 5. Diagram of deformation estimation results

下载 (90KB)
7. Fig. 6. Graph of dependence of M(ρ) on the thickness of the specimen

下载 (63KB)

版权所有 © Vantsov S., Khomutskaya O., Liin E., 2023