Email this article Influence of design parameters on plane strain of printed circuit boards
- Authors: Vantsov S.1, Khomutskaya O.1, Liin E.1
-
Affiliations:
- МАИ (НИУ)
- Issue: No 8 (229) (2023)
- Pages: 108-112
- Section: Design solutions
- URL: https://journals.eco-vector.com/1992-4178/article/view/632348
- DOI: https://doi.org/10.22184/1992-4178.2023.229.8.108.112
- ID: 632348
Cite item
Open Access
Access granted
Abstract
The article describes the development of mathematical model of plane strain of printed circuit board layers and experimental verification of its accuracy. The obtained experimental results qualitatively completely coincide with the calculation results; the quantitative discrepancy does not exceed 20%, which can be considered satisfactory at this step of clarifying the model coefficients taking into account random factors.
Full Text
About the authors
S. Vantsov
МАИ (НИУ)
Author for correspondence.
Email: van2851@mail.ru
к. т. н., доцент
Russian FederationO. Khomutskaya
МАИ (НИУ)
Email: khomutskayaov@gmail.com
к. т. н., доцент
Russian FederationE. Liin
МАИ (НИУ)
Email: elijn@bk.ru
аспирант каф. 307
Russian FederationReferences
- Никитин С., Поздняков К., Хомутская О. Оценка деформации печатных плат // ЭЛЕКТРОНИКА: Наука, Технология, Бизнес. 2019. № 5. С. 144–150.
- Куликов Н., Хомутская О., Ванцов С. Цифровой метод автоматизированной оценки деформации печатной платы // ЭЛЕКТРОНИКА: Наука, Технология, Бизнес. 2018. № 2. С. 186–191.
Supplementary files
