Metal-ceramic packages from “ZPP» JSC for RF and microwave devices

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Abstract

The article considers the development and production at «Semiconductor Device Plant» JSC («ZPP» JSC) of leadless metal-ceramic packages for RF and microwave devices, examples of such products are also given.

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About the authors

Sh. Shugaepov

АО «ЗПП»; ФГБОУ ВО «МарГУ»

Author for correspondence.
Email: shnshugaepov@zpp12.ru

директор по развитию; научный сотрудник

Russian Federation

E. Ermolaev

АО «ЗПП»; ФГБОУ ВО «МарГУ»

Email: ermolaev_ev@zpp12.ru

заместитель главного конструктора по новым разработкам; научный сотрудник

Russian Federation

V. Egoshin

АО «ЗПП»; ФГБОУ ВО «МарГУ»

Email: vaegoshin@zpp12.ru

заместитель главного конструктора по материалам; научный сотрудник

Russian Federation

A. Gluntsov

АО «ЗПП»

Email: journal@electronics.ru

инженер-конструктор группы опытного производства

Russian Federation

Supplementary files

Supplementary Files
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1. JATS XML
2. Fig. 1. General view, overall view, overall, mounting and connecting dimensions of the MK 5152.52-2 housing

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3. Fig. 2. General view, overall view, overall, mounting and connecting dimensions of the MK 5164.40-2 housing

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4. Fig. 3. General view, overall view, overall, mounting and connecting dimensions of the MK 5153.64-4 housing

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5. Fig. 4. General view, overall view, overall, mounting and connection dimensions of the MK 5182.100-1 housing

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6. Fig. 5. General view, overall view, overall, mounting and connecting dimensions of the MK 5171.40-3 housing

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7. Fig. 6. General view, overall view, overall, mounting and connecting dimensions of the MK 5159.24-1 housing

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8. Fig. 7. General view, overall view, overall, mounting and connecting dimensions of the MK 5165.44-1 housing

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9. Fig. 8. General view, overall view, overall, mounting and connection dimensions of the MK 5131.22-1HZ housing

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Copyright (c) 2024 Shugaepov S., Ermolaev E., Egoshin V., Gluntsov A.

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