Enviar artigo por via de e-mail Extreme silicon wafers thinning and formation of nano TSV for 3D heterogeneous integration
- Autores: Sukhanov D.1
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Afiliações:
- ООО «Остек-ЭК»
- Edição: Nº 2 (2025)
- Páginas: 112-114
- Seção: Micro and nanostructures
- URL: https://journals.eco-vector.com/1992-4178/article/view/680354
- DOI: https://doi.org/10.22184/1992-4178.2025.243.2.112.114
- ID: 680354
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Resumo
The article considers the state-of-the art technologies that make it possible to thin silicon wafers to 500 nm and form nano TSV with dimensions of 180x250 nm and a depth of 500 nm.
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Sobre autores
D. Sukhanov
ООО «Остек-ЭК»
Autor responsável pela correspondência
Email: Sukhanov.d@ostec-group.ru
заместитель технического директора
RússiaBibliografia
- Суханов Д. Шаг по направлению к квантовой электронике или жизнь микроэлектроники в эпоху постМура // Вектор высоких технологий. 2021. №2 (52). С. 20–25.
- Thomas D., Jourdain A. Extreme Si thinning and nano-TSVs to advance 3D heterogeneous integration // Chip Scale Review. 2021. V. 25. No. 1. PP. 34–38.
- Jourdain A. et al. Extreme thinning of Si wafers for via-last and multi-wafer stacking applications. – IEEE 68th Electronic Components and Technology Conference (ECTC). 29 May – 01 June 2018.
- Jourdain A. et al. Extreme wafer thinning and nano-TSV processing for 3D heterogeneous integration. IEEE 70th Electronic Components and Technology Conference (ECTC) in IEEE ECTC. June 2020.
- Van Huylenbroeck S. et al. A highly reliable 1 × 5 μm via-last TSV module. – IEEE International Interconnect Technology Conference (IITC). 2018.
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Fig. 1. Typical structures of devices with micro-TSV (a) and nano-TSV (b) [2]
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Fig. 2. The process of extreme thinning to 500 nm after plate-to-plate bonding [2]
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Fig. 3. Thickness of the Si and TTV working plate at the stages of the thinning process [2]
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Fig. 4. The sequence of the TSV structure formation process: a – alignment of Si-TSV with the lower part of M1, dry etching, stopping at STI; b – deposition of a silicon oxide sleeve (10 nm), etching at the bottom; c – metallization of TSV and Cu CMP; d – formation of BSM1. BS PASS – passivation layer on the back of the plate [2]
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Fig. 5. Setting up the nano-TSV etching process and an example after filling with Cu and CMP: a – the etching process using inductively coupled plasma (ICP); b – Bosch process at the initial stage; c – configured Bosch process; d – after filling with Cu and CMP [2]
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