Micro and nanostructures
| Issue | Title | File | |
| No 2 (2025) | Extreme silicon wafers thinning and formation of nano TSV for 3D heterogeneous integration |
 (Rus) |
|
| Sukhanov D. | |||
| No 9 (2024) | Recent achievements in creating chiplets using bridge interconnects |
(Rus) |
|
| Sukhanov D. | |||
| No 8 (2024) | EUV lithography: what is expected in 2025? |
(Rus) |
|
| Makushin M. | |||
| No 8 (2024) | Reverse growth of pyrolytic ZnO films |
(Rus) |
|
| Permyakov D., Strogonov A., Nebolsin V., Belykh M. | |||
| No 2 (2023) | Electrolytic anodizing of silicon, silicon carbide and silicon nitride for nanotechnology purposes (review) |
(Rus) |
|
| Makharinets A., Mileshko L. | |||
| No 2 (2023) | Characteristics of silicon cantilevers for atomic force microscopy from Angstrem JSC |
(Rus) |
|
| Novak A., Sokolov A., Kovalev V. | |||
| No 7 (2023) | Study of memristor structures based on copper and tin oxides |
(Rus) |
|
| Permyakov D., Strogonov A. | |||
| 1 - 7 of 7 Items | |||