| Issue |
Title |
File |
| No 7 (2025) |
Integration of a three-layer stack: the future of smart imaging devices |
(Rus)
|
|
Sukhanov D.
|
| No 6 (2025) |
High-frequency capacitors manufactured using MEMS Technology |
(Rus)
|
|
Kochemasov V., Gorbachev V., Khorev S.
|
| No 5 (2025) |
Modern technologies of chiplet heterogeneous integration |
(Rus)
|
|
Sukhanov D.
|
| No 5 (2025) |
Thin metal oxide films for flexible and stretchable electronic devices |
(Rus)
|
|
Belykh M., Permyakov D., Strogonov A.
|
| No 2 (2025) |
Extreme silicon wafers thinning and formation of nano TSV for 3D heterogeneous integration |
(Rus)
|
|
Sukhanov D.
|
| No 9 (2024) |
Recent achievements in creating chiplets using bridge interconnects |
(Rus)
|
|
Sukhanov D.
|
| No 8 (2024) |
EUV lithography: what is expected in 2025? |
(Rus)
|
|
Makushin M.
|
| No 8 (2024) |
Reverse growth of pyrolytic ZnO films |
(Rus)
|
|
Permyakov D., Strogonov A., Nebolsin V., Belykh M.
|
| No 2 (2023) |
Electrolytic anodizing of silicon, silicon carbide and silicon nitride for nanotechnology purposes (review) |
(Rus)
|
|
Makharinets A., Mileshko L.
|
| No 2 (2023) |
Characteristics of silicon cantilevers for atomic force microscopy from Angstrem JSC |
(Rus)
|
|
Novak A., Sokolov A., Kovalev V.
|
| No 7 (2023) |
Study of memristor structures based on copper and tin oxides |
(Rus)
|
|
Permyakov D., Strogonov A.
|
| 1 - 11 of 11 Items |
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