Enviar artigo por via de e-mail Four ways to decapsulate semiconductor devices
- Autores: Varlamov P.1
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Afiliações:
- Компания «Глобал Микроэлектроника»
- Edição: Nº 1 (2025)
- Páginas: 70-74
- Seção: Manufacturing technologies
- URL: https://journals.eco-vector.com/1992-4178/article/view/683107
- DOI: https://doi.org/10.22184/1992-4178.2025.242.1.70.74
- ID: 683107
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Resumo
Decapsulation is the removal of the component package without damaging the internal structure of the product and maintaining its functionality. The article discusses modern
methods of decapsulation of semiconductor devices, their advantages and disadvantages, and methods of application.
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Sobre autores
P. Varlamov
Компания «Глобал Микроэлектроника»
Autor responsável pela correspondência
Email: vpi@global-micro.ru
ведущий инженер
RússiaBibliografia
- Kor H.B., Liu Q., Gan C.L. Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package. // IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). 2020. PP. 1–6.
- Obein M. 4 main decapsulation ways // Digit Concept, France. 2017.
- Брюхно Н.А., Дракин А.Ю., Котова М.Ю. Маска для декорпусирования устройств микроэлектроники в полимерном корпусе. Патент RU 199130 U1 (АО «Группа Кремний Эл»).
- Анашин В.С., Никольская Т.В., Сурнин В.Н., Яскин Ю.С. Способ декорпусирования интегральных микросхем. Патент RU 2 572 290 C1 (ОАО «ОРКК»).
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Fig. 1. X-ray identification of the component
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Fig. 2. Manual mechanical decapsulation unit
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Fig. 3. The result of targeted chemical action on the microcircuit body
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Fig.4. Decapsulation setup of iAS777DC and examples of the results of acid etching of EMC compounds
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Fig. 5. Examples of laser decapsulation applications: a – opened ceramic microwave case; b – copper coil of RFID tag; c – removal of burnt SMD components
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Fig. 6. Opening a “window” with laser radiation
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Fig. 7. Combined laser-plasma action
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