Modern technologies of chiplet heterogeneous integration
- 作者: Sukhanov D.1
-
隶属关系:
- ООО «Остек-ЭК»
- 期: 编号 5 (2025)
- 页面: 104-108
- 栏目: Micro and nanostructures
- URL: https://journals.eco-vector.com/1992-4178/article/view/686470
- DOI: https://doi.org/10.22184/1992-4178.2025.246.5.104.108
- ID: 686470
如何引用文章
详细
Chiplet-based systems provide a number of advantages from a design and manufacturing perspective, but at the same time require the implementation of advanced packaging and heterogeneous integration technologies. The article provides an overview of modern methods for creating interconnects in chiplet-based systems.
全文:

作者简介
D. Sukhanov
ООО «Остек-ЭК»
编辑信件的主要联系方式.
Email: sukhanov.d@ostec-group.ru
заместитель технического директора
俄罗斯联邦参考
- Lau J.H. Bridges for chiplet design and heterogeneous integration packaging // Chip Scale Review. January-February, 2022. PP. 21–28.
补充文件
