电邮这篇文章 Modern technologies of chiplet heterogeneous integration
- 作者: Sukhanov D.1
-
隶属关系:
- ООО «Остек-ЭК»
- 期: 编号 5 (2025)
- 页面: 104-108
- 栏目: Micro and nanostructures
- URL: https://journals.eco-vector.com/1992-4178/article/view/686470
- DOI: https://doi.org/10.22184/1992-4178.2025.246.5.104.108
- ID: 686470
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详细
Chiplet-based systems provide a number of advantages from a design and manufacturing perspective, but at the same time require the implementation of advanced packaging and heterogeneous integration technologies. The article provides an overview of modern methods for creating interconnects in chiplet-based systems.
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作者简介
D. Sukhanov
ООО «Остек-ЭК»
编辑信件的主要联系方式.
Email: sukhanov.d@ostec-group.ru
заместитель технического директора
俄罗斯联邦参考
- Lau J.H. Bridges for chiplet design and heterogeneous integration packaging // Chip Scale Review. January-February, 2022. PP. 21–28.
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Fig. 1. Modern technologies of packaging and heterogeneous integration
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Fig. 2. Structures created using different heterogeneous integration technologies
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Fig. 3. Chiplet design and TSV-based interconnects in Virtex-7 HT family FPGAs
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Fig. 4. Chiplet design of the 7002 series server processor from AMD
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Fig. 5. Intel EMIB structure, bump locations on chiplets, and Agilex FPGA module block diagram
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Fig. 6. DBHi structure from IBM
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Fig. 7. TSMC interconnect designs: InFO_LSI and CoWoS_LSI
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Fig. 8. Using flexible bridges to connect chiplets
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