LDMOS: the new products by NIIET JSC

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Abstract

The article provides information about LDMOS process improvements at NIIET JSC, as well as about new microwave transistors under development by the company which are based on this technology and designed for DVB-T / DVB-T2 TV equipment.

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About the authors

R. Alekseev

АО «НИИЭТ»

Author for correspondence.
Email: redactor@electronics.ru

ведущий инженер

Russian Federation

I. Semeykin

АО «НИИЭТ»

Email: redactor@electronics.ru

к. т. н., технический директор

Russian Federation

A. Tsotsorin

АО «НИИЭТ»

Email: redactor@electronics.ru

к. ф.-м. н., начальник отдела

Russian Federation

P. Kurshev

АО «НИИЭТ»

Email: redactor@electronics.ru

начальник лаборатории

Russian Federation

References

  1. Combs A. Application Note AN-007: A Comparative Review of GaN, LDMOS, and GaAs for RF and Microwave Applications // NuWaves Engineering // https://nuwaves.com/wp-content/uploads/2020/08/AN-007-A-Comparative-Review-of-GaN-LDMOS-and-GaAs-for-RF-and-Microwave-Applications.pdf
  2. Joosting J.-P. Why LDMOS is the best technology for RF energy // eeNews Wireless. Technology News. 2018. June 21. // https://www.eenewseurope.com/en/why-ldmos-is-the-best-technology-for-rf-energy/
  3. Dhanyal H. R. et al. Miniaturized High-Efficiency Pulsed-Power Amplifier for Surveillance and Tracking Radar // 2020 5th International Conference on Computer and Communication Systems (ICCCS). – IEEE, 2020. PP. 840–843.
  4. Theeuwen S. et al. LDMOS technology for power amplifiers up to 12 GHz // 2018 13th European Microwave Integrated Circuits Conference (EuMIC). – IEEE, 2018. PP. 162–165.
  5. Алексеев Р., Цоцорин А., Черных М. Мощные СВЧ LDMOS-транзисторы для рабочих частот до 3 ГГц // ЭЛЕКТРОНИКА: Наука, Технология, Бизнес. 2020. № 4. С. 98–100.
  6. Алексеев Р., Куршев П., Цоцорин А. Влияние многослойного полевого электрода на степень выраженности эффекта квазинасыщения вольт-амперных характеристик мощных сверхвысокочастотных латеральных транзисторов // Физика и техника полупроводников. 2022. Т. 56. № 11. С. 1088–1092.

Supplementary files

Supplementary Files
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1. JATS XML
2. Fig.1. Model of LDMOS structure with three-layer PE

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3. Fig.2. Typical metallization system for the stock finger of an LDMOS transistor

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4. Fig.3. Contact window etched in a dielectric layer about 1.5 µm thick. The narrowing of the window bottom is visible

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5. Fig.4. Heat propagation along the silicon substrate: a – from a single finger; b – from several fingers spaced apart

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Copyright (c) 2023 Alekseev R., Semeykin I., Tsotsorin A., Kurshev P.

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