Email this article Modern technologies of chiplet heterogeneous integration
- Authors: Sukhanov D.1
-
Affiliations:
- ООО «Остек-ЭК»
- Issue: No 5 (2025)
- Pages: 104-108
- Section: Micro and nanostructures
- URL: https://journals.eco-vector.com/1992-4178/article/view/686470
- DOI: https://doi.org/10.22184/1992-4178.2025.246.5.104.108
- ID: 686470
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Abstract
Chiplet-based systems provide a number of advantages from a design and manufacturing perspective, but at the same time require the implementation of advanced packaging and heterogeneous integration technologies. The article provides an overview of modern methods for creating interconnects in chiplet-based systems.
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About the authors
D. Sukhanov
ООО «Остек-ЭК»
Author for correspondence.
Email: sukhanov.d@ostec-group.ru
заместитель технического директора
Russian FederationReferences
- Lau J.H. Bridges for chiplet design and heterogeneous integration packaging // Chip Scale Review. January-February, 2022. PP. 21–28.
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Fig. 1. Modern technologies of packaging and heterogeneous integration
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Fig. 2. Structures created using different heterogeneous integration technologies
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Fig. 3. Chiplet design and TSV-based interconnects in Virtex-7 HT family FPGAs
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Fig. 4. Chiplet design of the 7002 series server processor from AMD
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Fig. 5. Intel EMIB structure, bump locations on chiplets, and Agilex FPGA module block diagram
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Fig. 6. DBHi structure from IBM
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Fig. 7. TSMC interconnect designs: InFO_LSI and CoWoS_LSI
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Fig. 8. Using flexible bridges to connect chiplets
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