Email this article Laser reballing: how modern technologies help improve electronics
- Authors: Shikhov S.1
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Affiliations:
- Компания А-КОНТРАКТ
- Issue: No 6 (2025)
- Pages: 134-137
- Section: Manufacturing technologies
- URL: https://journals.eco-vector.com/1992-4178/article/view/688726
- DOI: https://doi.org/10.22184/1992-4178.2025.247.6.134.136
- ID: 688726
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Abstract
Laser reballing is an innovative technology for repairing ICs in BGA packages that uses a laser for precise positioning and reliable soldering of solder balls to the BGA component package. The article describes the technological process and discusses the advantages of the method.
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About the authors
S. Shikhov
Компания А-КОНТРАКТ
Author for correspondence.
Email: sergey@acont.ru
директор по управлению проектами
Russian FederationSupplementary files
Supplementary Files
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JATS XML
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Fig. 1. Operation of a laser installation for reballing BGA microcircuits (photo provided by A-CONTRACT)
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Fig. 2. The laser reballing process: a – setup diagram; b – the solder ball enters the nozzle; c – the laser melts the solder ball, the ball exits the nozzle and is soldered to the chip pad; d – transition to the next pad, repeating the cycle
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Fig. 3
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