电邮这篇文章 Laser reballing: how modern technologies help improve electronics
- 作者: Shikhov S.1
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隶属关系:
- Компания А-КОНТРАКТ
- 期: 编号 6 (2025)
- 页面: 134-136
- 栏目: Manufacturing technologies
- URL: https://journals.eco-vector.com/1992-4178/article/view/688726
- DOI: https://doi.org/10.22184/1992-4178.2025.247.6.134.136
- ID: 688726
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详细
Laser reballing is an innovative technology for repairing ICs in BGA packages that uses a laser for precise positioning and reliable soldering of solder balls to the BGA component package. The article describes the technological process and discusses the advantages of the method.
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作者简介
S. Shikhov
Компания А-КОНТРАКТ
编辑信件的主要联系方式.
Email: sergey@acont.ru
директор по управлению проектами
俄罗斯联邦补充文件
附件文件
动作
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JATS XML
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Fig. 1. Operation of a laser installation for reballing BGA microcircuits (photo provided by A-CONTRACT)
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Fig. 2. The laser reballing process: a – setup diagram; b – the solder ball enters the nozzle; c – the laser melts the solder ball, the ball exits the nozzle and is soldered to the chip pad; d – transition to the next pad, repeating the cycle
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Fig. 3
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