Artificial intelligence and the semiconductor industry

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Abstract

The development of artificial intelligence is impossible without the creation of a specialized element base and CAD tools for its design. At the same time, the introduction of AI systems affects the development of new CAD systems and their functioning.

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About the authors

M. Makushin

НОБ «Военные науки и оборонная промышленность» БРЭ

Author for correspondence.
Email: kys@electronics.ru

ведущий научный редактор

Russian Federation

References

  1. Макушин М. Искусственный интеллект: новые архитектуры ИИ процессоров и расширение роли в проектировании ИС // ЭЛЕКТРОНИКА: Наука, Технология, Бизнес. 2024. № 10 (00241). С. 138–147.
  2. Bailey B. Multi-Modal AI In EDA Development Flows // Semiconductor Engineering. July 31st, 2025.
  3. Moyer B. The Best DRAMs For Artificial Intelligence //Semiconductor Engineering. June 12th, 2025.
  4. Allan L. Mobile Chip Challenges In The AI Era // Semiconductor Engineering. June 5th, 2025.
  5. Allan L. AI Pushes High-End Mobile From SoCs To Multi-Die // Semiconductor Engineering. July 8th, 2025.

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2. Fig. 1. Comparison of different synchronous DRAM families. Capacities are calculated on a per-die basis (not per-stack for HBM). No one family has advantages in all areas. DDR and LPDDR DRAM may have comparable bandwidth and capacity, but the main differentiator is cost. Source: Bryon Moyer/Semiconductor Engineering

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3. Fig. 2. A smartphone use case where a large language model (LLM) or AI engine must be available in storage. Source: Synopsys

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4. Fig. 3. Comparison of a monolithic system-on-chip and a multi-chip system. Source: Synopsys 

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Copyright (c) 2025 Makushin M.