Artificial intelligence and the semiconductor industry

Capa

Citar

Texto integral

Acesso aberto Acesso aberto
Acesso é fechado Acesso está concedido
Acesso é fechado Acesso é pago ou somente para assinantes

Resumo

The development of artificial intelligence is impossible without the creation of a specialized element base and CAD tools for its design. At the same time, the introduction of AI systems affects the development of new CAD systems and their functioning.

Texto integral

Acesso é fechado

Sobre autores

M. Makushin

НОБ «Военные науки и оборонная промышленность» БРЭ

Autor responsável pela correspondência
Email: kys@electronics.ru

ведущий научный редактор

Rússia

Bibliografia

  1. Макушин М. Искусственный интеллект: новые архитектуры ИИ процессоров и расширение роли в проектировании ИС // ЭЛЕКТРОНИКА: Наука, Технология, Бизнес. 2024. № 10 (00241). С. 138–147.
  2. Bailey B. Multi-Modal AI In EDA Development Flows // Semiconductor Engineering. July 31st, 2025.
  3. Moyer B. The Best DRAMs For Artificial Intelligence //Semiconductor Engineering. June 12th, 2025.
  4. Allan L. Mobile Chip Challenges In The AI Era // Semiconductor Engineering. June 5th, 2025.
  5. Allan L. AI Pushes High-End Mobile From SoCs To Multi-Die // Semiconductor Engineering. July 8th, 2025.

Arquivos suplementares

Arquivos suplementares
Ação
1. JATS XML
Baixar
2. Fig. 1. Comparison of different synchronous DRAM families. Capacities are calculated on a per-die basis (not per-stack for HBM). No one family has advantages in all areas. DDR and LPDDR DRAM may have comparable bandwidth and capacity, but the main differentiator is cost. Source: Bryon Moyer/Semiconductor Engineering

Baixar (153KB)
Metadados
3. Fig. 2. A smartphone use case where a large language model (LLM) or AI engine must be available in storage. Source: Synopsys

Baixar (116KB)
Metadados
4. Fig. 3. Comparison of a monolithic system-on-chip and a multi-chip system. Source: Synopsys 

Baixar (226KB)
Metadados

Declaração de direitos autorais © Makushin M., 2025