Spray photoresist application to create a uniform film in cavities

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The article studies a method for obtaining coatings using a spray application system. The process parameters such as table rotation speed, nozzle movement speed, mixture flow, nozzle tilt angle, etc. were optimized.

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Sobre autores

V. Ivanov

ООО «ТТМ»

Autor responsável pela correspondência
Email: vi@ttmicro.ru

начальник технического отдела

Rússia

Bibliografia

  1. Duk-Soo Eun, Do-Wok Kim et al. Photoresist Spray Coating for Resist Film Performance of Deep Silicon Cavities // Journal of the Korean Physical Society. Vol. 50. No. 6. June 2007. PP. 1947–1951.
  2. Tonnies D. Spray coating & lithography technology for 3D topological structures // 5th SECAP seminare. Nov. 2004.
  3. Pham, N.P. et al. Spray coating of photoresist for pattern transfer on high topography surfaces // J. Micromech. Microeng. 15 (2005). PP. 691–697.
  4. Park H. et al. Design and Fabrication of the Double-Sided Silicon Microstrip Sensor // J. Korean Phys. Soc. 49. 1401 (2006).

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2. Fig. 1. Schematic diagram of photoresist spray application

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3. Fig. 2. Problems during the application of photoresist in cavities by centrifugation (a), uniform coverage of the cavity with a layer of photoresist by spray application (b)

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4. Fig. 3. Schematic diagram of the main module of the photoresist spraying unit

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5. Fig. 4. Division of the plate into nine sections for photoresist thickness measurements (a), photoresist thickness at different nozzle movement speeds at a stage rotation speed of 30 rpm (b)

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6. Fig. 5. Measurement of the photoresist layer thickness using SEM on the cross section of the cavity corner (a), cross section of the cavity bottom (b)

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7. Fig. 6. Measurement of the photoresist layer thickness using SEM on the plate (a), cross section of the cavity corner (b), cross section of the cavity bottom (c)

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8. Fig. 7. Coated optical parts

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9. Fig. 8. Plastic part with applied protective coating

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Declaração de direitos autorais © Ivanov V., 2024