Spray photoresist application to create a uniform film in cavities
- Autores: Ivanov V.1
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Afiliações:
- ООО «ТТМ»
- Edição: Nº 7 (2024)
- Páginas: 182-188
- Seção: Manufacturing technologies
- URL: https://journals.eco-vector.com/1992-4178/article/view/636203
- DOI: https://doi.org/10.22184/1992-4178.2024.238.7.182.188
- ID: 636203
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Resumo
The article studies a method for obtaining coatings using a spray application system. The process parameters such as table rotation speed, nozzle movement speed, mixture flow, nozzle tilt angle, etc. were optimized.
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Sobre autores
V. Ivanov
ООО «ТТМ»
Autor responsável pela correspondência
Email: vi@ttmicro.ru
начальник технического отдела
RússiaBibliografia
- Duk-Soo Eun, Do-Wok Kim et al. Photoresist Spray Coating for Resist Film Performance of Deep Silicon Cavities // Journal of the Korean Physical Society. Vol. 50. No. 6. June 2007. PP. 1947–1951.
- Tonnies D. Spray coating & lithography technology for 3D topological structures // 5th SECAP seminare. Nov. 2004.
- Pham, N.P. et al. Spray coating of photoresist for pattern transfer on high topography surfaces // J. Micromech. Microeng. 15 (2005). PP. 691–697.
- Park H. et al. Design and Fabrication of the Double-Sided Silicon Microstrip Sensor // J. Korean Phys. Soc. 49. 1401 (2006).
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Fig. 2. Problems during the application of photoresist in cavities by centrifugation (a), uniform coverage of the cavity with a layer of photoresist by spray application (b)
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Fig. 4. Division of the plate into nine sections for photoresist thickness measurements (a), photoresist thickness at different nozzle movement speeds at a stage rotation speed of 30 rpm (b)
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Fig. 5. Measurement of the photoresist layer thickness using SEM on the cross section of the cavity corner (a), cross section of the cavity bottom (b)
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Fig. 6. Measurement of the photoresist layer thickness using SEM on the plate (a), cross section of the cavity corner (b), cross section of the cavity bottom (c)
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