The use of photolithography for the manufacture of metal components at ZPP JSC

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The article considers the use of photolithography at Plant of Semiconductor Devices JSC (ZPP JSC) for the manufacture of various metal components. Examples of products manufactured using this technology are given.

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作者简介

E. Pankratova

АО «ЗПП»

编辑信件的主要联系方式.
Email: ktc121@zpp12.ru

инженер-технолог

俄罗斯联邦

Sh. Shugaepov

АО «ЗПП»; ФГБОУ ВО «МарГУ»

Email: shnshugaepov@zpp12.ru

директор по развитию; научный сотрудник

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E. Ermolaev

АО «ЗПП»; ФГБОУ ВО «МарГУ»

Email: ermolaev_ev@zpp12.ru

заместитель главного конструктора по новым разработкам; научный сотрудник

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V. Egoshin

АО «ЗПП»; ФГБОУ ВО «МарГУ»

Email: vaegoshin@zpp12.ru

заместитель главного конструктора по материалам; научный сотрудник

俄罗斯联邦

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2. Fig.1. Metal blanks with photoresist applied by dipping method

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3. Fig.2. Photomask (for 108-pin frame)

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4. Fig.3. Developed workpiece prepared for etching operation

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5. Fig.4. The workpiece after the etching operation. Lead frames are connected using jumpers

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6. Fig.5. Lead frames: a – 50 × 212 mm in size from 42N-0.15, the number of leads in one frame is 100, the total number of frames is 8, the minimum distance between leads is 0.15 mm; b – 50.8 × 195 mm in size from DPRNT M1-0.2 with a total number of pins 4480, the minimum distance between pins is 0.15 mm; c – size 50.8 × 195 mm from DPRNT M1-0.2 with a total number of pins 3180, minimum distance between pins – 0.45 mm; g – size 28 × 214 mm from DPRNT M1-0.2 with a total number of pins 384, minimum distance between pins – 0.3 mm

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7. Fig.6. Two-level cover 0.4 mm thick made of 29NK

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版权所有 © Pankratova E., Shugaepov S., Ermolaev E., Egoshin V., 2023

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