The use of photolithography for the manufacture of metal components at ZPP JSC

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Abstract

The article considers the use of photolithography at Plant of Semiconductor Devices JSC (ZPP JSC) for the manufacture of various metal components. Examples of products manufactured using this technology are given.

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About the authors

E. Pankratova

АО «ЗПП»

Author for correspondence.
Email: ktc121@zpp12.ru

инженер-технолог

Russian Federation

Sh. Shugaepov

АО «ЗПП»; ФГБОУ ВО «МарГУ»

Email: shnshugaepov@zpp12.ru

директор по развитию; научный сотрудник

Russian Federation

E. Ermolaev

АО «ЗПП»; ФГБОУ ВО «МарГУ»

Email: ermolaev_ev@zpp12.ru

заместитель главного конструктора по новым разработкам; научный сотрудник

Russian Federation

V. Egoshin

АО «ЗПП»; ФГБОУ ВО «МарГУ»

Email: vaegoshin@zpp12.ru

заместитель главного конструктора по материалам; научный сотрудник

Russian Federation

Supplementary files

Supplementary Files
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1. JATS XML
2. Fig.1. Metal blanks with photoresist applied by dipping method

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3. Fig.2. Photomask (for 108-pin frame)

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4. Fig.3. Developed workpiece prepared for etching operation

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5. Fig.4. The workpiece after the etching operation. Lead frames are connected using jumpers

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6. Fig.5. Lead frames: a – 50 × 212 mm in size from 42N-0.15, the number of leads in one frame is 100, the total number of frames is 8, the minimum distance between leads is 0.15 mm; b – 50.8 × 195 mm in size from DPRNT M1-0.2 with a total number of pins 4480, the minimum distance between pins is 0.15 mm; c – size 50.8 × 195 mm from DPRNT M1-0.2 with a total number of pins 3180, minimum distance between pins – 0.45 mm; g – size 28 × 214 mm from DPRNT M1-0.2 with a total number of pins 384, minimum distance between pins – 0.3 mm

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7. Fig.6. Two-level cover 0.4 mm thick made of 29NK

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Copyright (c) 2023 Pankratova E., Shugaepov S., Ermolaev E., Egoshin V.

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