Investigation of the curing process of the polymeric binder based on their dielectric parameters when creating a dimensionally stable thin-walled structures resistance to the negative space factors - PDF (俄语)
版权所有 © Vlasov A.Y., Pasechnik K.A., Martynov V.A., 2014

此作品已接受知识共享署名 4.0国际许可协议的许可