Improving the reliability characteristics of multi-lead metal-ceramic packages from ZPP JSC through the use of test systems

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Abstract

The article considers the test equipment that is used in Semiconductor Device Plant JSC (ZPP JSC) in the manufacture of multi-lead metal-ceramic IC packages.

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About the authors

R. Ermilov

АО «ЗПП»

Author for correspondence.
Email: redactor@electronics.ru

начальник конструкторского отдела

Russian Federation

Sh. Shugaepov

АО «ЗПП»

Email: redactor@electronics.ru

директор по развитию

Russian Federation

E. Ermolaev

АО «ЗПП»

Email: redactor@electronics.ru

заместитель главного конструктора по новым разработкам

Russian Federation

V. Egoshin

АО «ЗПП»

Email: redactor@electronics.ru

заместитель главного конструктора по материалам

Russian Federation

Supplementary files

Supplementary Files
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1. JATS XML
2. Fig.1. Type 8 metal-ceramic housing manufactured for flip-chip technology

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3. Fig.2. Installation of test control with “flying” probes

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4. Fig.3. Testing of metal-ceramic boards

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5. Fig.4. Needle type probe

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6. Fig.5. 4-Wire Probes

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Copyright (c) 2024 Ermilov R., Shugaepov S., Ermolaev E., Egoshin V.

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