Email this article AOI from China for Russian production facilities
- Authors: Shurov D.1
-
Affiliations:
- ООО «Солидус»
- Issue: No 7 (2025)
- Pages: 130-135
- Section: Reliability and validation
- URL: https://journals.eco-vector.com/1992-4178/article/view/690224
- DOI: https://doi.org/10.22184/1992-4178.2025.249.7.130.135
- ID: 690224
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Abstract
The article provides an overview of solutions for automatic optical inspection of printed circuit boards during production from ALeader.
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About the authors
D. Shurov
ООО «Солидус»
Author for correspondence.
Email: ds@slds.ru
руководитель направления контрольного оборудования
Russian FederationSupplementary files
Supplementary Files
Action
1.
JATS XML
2.
Fig. 1. ALeader office and production facilities
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3.
Fig. 2. ALeader 2D and 3D AOI: a – linear 3D AOI ALD8700 series; b – linear 2D AOI ALD7700/5800 series; c – offline 2D AOI ALD7200/7100 series
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4.
Fig. 3. ALeader high-tech 3D inspection head
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5.
Fig. 4. ALeader moire grating pattern on chip resistors
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6.
Fig. 5. Possibility to select IPC-610 standard class in software
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7.
Fig. 6. Fillet height is an important parameter for inspection according to IPC-610 standard
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8.
Fig. 7. 3D inspection by fillet volume, height, profile and slope using defective (left) and good (right) component as an example
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9.
Fig. 8. Profile and slope growth control of the fillet using the example of the “head-on-pillow” defect (left) in comparison with a good component (right)
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10.
Fig. 9. A microcircuit in a SOIC package with a defect of broken lead coplanarity
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11.
Fig. 10. Violation of the package coplanarity using the example of a capacitor, one side of which is raised by 127 µm relative to the other
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12.
Fig. 11. The “tombstone” type defect
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13.
Fig. 12. A defect of the dimensions violation, when a capacitor of the same size, but with a thicker case, was installed in place of a resistor
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14.
Fig. 13. The “billboarding” defect - mounting a component on its side
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15.
Fig. 14. Control of the component displacement relative to the boundaries of the contact pads
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16.
Fig. 15. Recognition of OCR marking “on the fly”
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17.
Fig. 16. An example of foreign objects found on a printed circuit board (the object dimensions in three dimensions are shown in the corner of the image, indicating that this algorithm works in 3D format)
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18.
Fig. 17. Settings for searching for foreign materials not only by area, but also by height
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19.
Fig. 18. Inspection of tall aluminum capacitors
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20.
Fig. 19. Pin inspection
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21.
Fig. 20. ALeader ALD6700 linear 3D SPI system
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22.
Fig. 21. An example of building an accurate 3D model of a paste print
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23.
Fig. 22. No shading effect due to the use of two 3D projectors (on the right) instead of one (on the left)
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24.
Fig. 23. An example of inspection of glue for SMT assembly
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25.
Fig. 24. ALeader inspections at each assembly stage (from left to right): SPI, Pre-AOI, Post-AOI
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26.
Fig. 25. The verification station operator has data on all stages of the assembly process to analyze the causes of defects
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